Chungwha Picture Tubes, Ltd.

Lee Yu-Chou

Chen Chiun-Hung

In those conventional arts, for large-size LCD, the process of copper damascene interconnect has some problems of forming a uneven copper seed layer and forming hollows during electrical plating due to the electrical plating area being too large to electroplate uniformly. In this invention, it employs a Cu tape to directly stick on a substrate to replace forming a copper seed layer and electroplating. Hence, the invention avoids the problem of unevenness and hollows in those conventional arts and so the Cu lines can be applied to the large-size LCD.

Manufacturing method and structure of copper lines for a liquid crystal panel

The present invention relates to reduce contact impedance of a gate electrode of a thin film transistor (TFT). It employs a double layer of AlNd/Cr or AlNd/Cr silicide as a material of the gate electrode and employs plasma atmosphere to clean a contact surface of the gate electrode.

Growing community of inventors

Taipei, Taiwan

Lee Yu-Chou