Stratos International, Inc.

Intel Corporation

Stratos Lightwave, Inc.

Other

Tyco Electronics Corporation

Emcore Corporation

Lee Xu

Hengju Cheng

Darren S Crews

Brian H Kim

Jesse Chin

William H Wang

Michael M O'Toole

Bradley S Levin

Philip J Edwards

Joseph John Vandenberg

Miaobin Gao

An-Chun Tien

Graham Flower

Joseph Markham

Chien-Chang Liu

Guobin Liu

Yousheng Wu

Xiaojie J Xu

Frank Wang

Joseph L Vandenberg

Simon Lee, Ii

Thiri Lwin

Wei-zen Lo

Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Redundant channel implementation to extend optical transceiver lifetime and reliability

A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

Apparatus for electrical and optical interconnection

A transceiver is disclosed. The transceiver includes a carrier assembly having active components to transmit and receive optical input/output (I/O); and a connector, coupled to the carrier assembly to couple optical I/O between the active components and a waveguide.

Fiber optic communication assembly

A parallel optics module including singulated dies. A first singulated die includes a first semiconductor optical component, and a second die includes a second semiconductor optical component. The first and second dies are mounted to a substrate. The first and second dies to be integrated into a parallel optics module.

Singulated dies in a parallel optics module

An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Transceiver assembly for use in fiber optics communications

A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule. The frame section is part of a larger carrier assembly including a multilayer circuit board which may include a microcontroller chip, an edge connector for electrically connecting with a computer or communications system and a flex circuit which provides communications lines linking the frame section, circuit board and edge connector.

An optoelectric module adapted to cooperate with a multi-fiber array by displacing a plurality of OEDs from the fiber array at least along the z,y-axes or a combination thereof while maintaining their alignment along either the x-axis of the fiber array, the module comprising: (a) a connector interface adapted to interconnect with a multi-fiber assembly having an x,y array of fibers; (b) a plurality of OEDs for converting between optical and electrical signals; and (c) optical paths wherein each optical path has a first end adapted for optically coupling with a corresponding fiber in an x,y array of fibers and a second end for optically coupling with a corresponding OED, wherein the distance between the second ends of at least two optical paths is greater than the distance between their corresponding first ends and wherein the distance across the second ends along the x-axis is no greater than the distance across the first ends along the x-axis.

Optoelectric module for multi-fiber arrays

A testable optical subassembly comprising a unitary structure of an optically-clear moldable material having at least the following features: (a) an optical path for transmitting optical signals between a fiber and an optoelectric device (OED); (b) a ferrule-receiving bore for receiving a ferrule and aligning a fiber held therein to the optical path; and (c) an OED-receiving cavity for receiving a lead frame and aligning an OED mounted thereon to the optical path along one or more axes.

Transceiver for LC connector

An optoelectronic subassembly for use in fiber optic communications systems where multiple parallel optical fibers are used in transmitting and receiving optical signals. The subassembly is adapted for optically connecting with a ferrule and electrically connecting to a larger computing or communications system. The ferrule supports a set of optical communications fibers disposed in an array. The subassembly supports an optoelectronic device having a set of photoactive components also disposed in an array corresponding to the fiber array. The optoelectronic device is operative for either converting photonic signals to electrical signals (in a receiver) or electrical signals to photonic signals (in a transmitter). The optoelectronic subassembly includes a carrier which is precisely fabricated using photolithography techniques for aligning and supporting the optoelectronic device and photoactive components within it. The carrier further includes a precisely positioned alignment structure for cooperating with the optical ferrule to align the photoactive components of the optoelectronic device with the fibers in the ferrule when the two are interconnected. Also, the carrier may include a thin film layer and one or more alignment marks applied to the film layer for use in accurately mounting the optoelectronic device on the carrier.

Parallel fiber optics communications module

An optoelectronic subassembly for use in fiber optic communications systems where multiple parallel optical fibers are used in transmitting and receiving optical signals. The subassembly is adapted for optically connecting with a ferrule and electrically connecting to a larger computing or communications system. The female supports a set of optical communications fibers disposed in an array. The subassembly supports an optoelectronic device having a set of photoactive components also disposed in an array corresponding to the fiber array. The optoelectronic device is operative for either converting photonic signals to electrical signals (in a receiver) or electrical signals to photonic signals (in a transmitter). The optoelectronic subassembly includes a carrier which is precisely fabricated using photolithography techniques for aligning and supporting the optoelectronic device and photoactive components within it. The carrier further includes a precisely positioned alignment structure for cooperating with the optical ferrule to align the photoactive components of the optoelectronic device with the fibers in the ferrule when the two are interconnected. Also, the carrier may include a thin film layer and one or more alignment marks applied to the film layer for use in accurately mounting the optoelectronic device on the carrier.

Growing community of inventors

Cupertino, CA, United States of America

Lee Xu