Taiwan Semiconductor Manufacturing Comp. Ltd.

Lee-Wen Hsu

Dian-Hau Chen

Liang-Wei Wang

Chih-Pin Chiu

Zhen De Ma

A redistribution structure is provided. A redistribution structure according to the present disclosure includes a first dielectric layer, a mesh metal feature disposed in the first dielectric layer and including a base portion and a frame portion surrounding the base portion, a second dielectric layer disposed over the first dielectric layer and the mesh metal feature, a redistribution feature disposed over the second dielectric layer, a passivation structure disposed over the redistribution feature and the second dielectric layer, a pad opening extending through the passivation structure to expose a top surface of the redistribution feature. The redistribution feature includes a plurality of contact vias that extend through the second dielectric layer to land on the frame portion of the mesh metal feature.

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Hsinchu, Taiwan

Lee-Wen Hsu