Seagate Technology Incorporated

Lee Walter

Zine-Eddine Boutaghou

Wayne Allen Bonin

Roger Lee Hipwell, Jr

Barry Dean Wissman

Barbara J Ihlow-Mahrer

Peter Crane

John Stuart Wright

Marsha Anne Huha

Mehmet Hancer

Markus Erwin Mangold

Shanlin X Hao

Moshe Olim

Derek A Lewis

Bruce Charlton Polson

Brian Dufrene

A microactuator comprises a mounting block, a head suspension, a compliant joint for connecting the mounting block to the head suspension, and a piezoelectric element for deforming the compliant joint in order to rotate the head suspension with respect to the mounting block. An encapsulant covers an exposed surface of the microactuator. The encapsulant comprises a self-assembled monolayer formed of an organosilicone or organosilane, where the self-assembled monolayer has a self-limiting thickness of one layer of a molecule.

Microactuator with self-assembled monolayer encapsulant

A slider is used in an actuation system and carries a transducing head for transducing data to and from a rotatable recording disc. The slider includes a slider body having a leading edge and a trailing edge and a transducing head positioned proximate the trailing edge of the slider body. An encapsulant comprised of a self assembled monolayer covers exposed surfaces the slider body.

Encapsulant for a disc drive component

A gimbal assembly includes a gimbal and a slider. The slider has at least one adhesive receiving feature which is formed on a mounting surface of the slider. The gimbal has a lock feature including at least one body that protrudes from a slider-engaging surface and terminates at a first end. Each body of the lock feature engages each adhesive receiving feature of the slider.

Head gimbal assembly using slider and gimbal features

A microactuator used for selectively altering a position of a transducing head carried by a slider in a disc drive system with respect to a track of a rotatable disc having a plurality of concentric tracks. The microactuator is of the type comprising a piezoelectric element. A polymer coating encapsulates all exposed surfaces of the piezoelectric element.

Encapsulant for microactuator suspension

A microactuation system selectively alters a position of a transducing head carried by a slider in a disc drive system with respect to a track of a rotatable disk having a plurality of concentric tracks. The microactuation system includes a head suspension having a first portion and a flexure for supporting the slider. A flexible beam extends from the first portion of the head suspension at one end to the flexure at the other end. An electroactive element is attached to the beam. The electroactive element bends in response to a control signal applied thereto. The beam is sufficiently compliant to permit movement of the first portion of the head suspension with respect to the flexure.

Bending microactuator having a two-piece suspension design

A slider for carrying and finely adjusting both a radial position and a flying height of a transducing head with respect to a track of a rotatable disc includes a stator portion carried by a support structure such as a flexure of a disc drive system. A plurality of springs extend from the stator portion and are flexible in a lateral direction (for radial positioning) and in a vertical direction (for flying height control). A rotor portion is connected to the stator portion by the plurality of springs. The rotor portion carries the transducing head. The stator portion includes a plurality of stator electrodes, and the rotor portion includes a plurality of rotor electrodes suspended between the stator electrodes. Selected voltages are applied to the stator electrodes and the rotor electrodes to create a selected force in the lateral and vertical directions for moving the rotor portion with respect to the stator portion to finely adjust the radial position and flying height of the transducing head.

Transducer-level microactuator with dual-axis control

A microactuator finely positions a transducing head carried by a slider adjacent a select radial track of disc. A frame of the microactuator includes a motor for altering the position of the slider and a closed bonding tub extending upward from the bottom of the microactuator having a bonding surface to engage the top surface of the slider. The closed bonding tub is formed from the microactuator frame such that there is a tub bottom having a bonding surface, sidewalls and an open sidewall.

Bonding tub improved electromagnetic microactuator in disc drives

A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.

Laterally supported handle wafer for through-wafer reactive-ion etch micromachining

A slider assembly is operable to selectively alter a position of a transducing head with respect to a track of a rotatable disc having a plurality of concentric tracks. The slider assembly includes a slider wafer arranged to be supported by a disc drive support structure. A stator is bonded to the slider wafer, with the stator including at least one electrode. A rotor is bonded to the stator, with the rotor having a frame portion bonded to the stator and a head-carrying portion attached to the frame portion by a flexible beam structure. The head-carrying portion of the rotor carries the transducing head, supports at least one rotor electrode adjacent to the at least one stator electrode, and is movable with respect to the frame portion of the rotor in response to a voltage difference between the at least one rotor electrode and the at least one stator electrode.

Bonded transducer-level electrostatic microactuator for disc drive system

A method for fabricating an integrated coil-on-keeper assembly for use in a magnetic circuit to actuate a microactuator. The assembly is formed on a keeper substrate by patterning an insulator layer, plating at least one coil layer and patterning another insulator layer on top of each coil layer. The keeper substrate is etched to form the top keeper of the coil-on-keeper assembly.

Fabrication method for integrated microactuator coils

A microactuator is built at the slider level to achieve high resolution positioning of a transducing head with respect to a track of a rotatable disc having a plurality of concentric tracks in a disc drive system. The slider includes a main body carried by a flexure. A stator portion extends from the main body, and a plurality of beams extend from the stator portion, the beams being flexible in a lateral direction. A rotor portion is connected to the stator portion by the plurality of beams, forming a gap between the stator portion and the rotor portion. The rotor portion carries the transducing head. A plurality of stator electrodes are formed on the stator portion, and a plurality of rotor electrodes are formed on the rotor portion to confront the stator electrodes across the gap. Control circuitry applies selected voltages to the stator electrodes and the rotor electrodes to create a force in the lateral direction for moving the rotor portion with respect to the stator portion of the slider, thereby finely positioning the transducing head.

Slider-level microactuator for precise head positioning

A microactuator is formed by defining stator and rotor regions on a wafer. Isolation barriers are formed in the stator and rotor regions to define a isolation regions. Conductive suspension beam are formed between the first and second isolation regions, and wafer material between the stator and rotor regions is removed to form a stator and a rotor. The microactuator is arranged to position a load device having an electrical component. The suspension beams support the rotor and load device and provide electrical connection between the stator and rotor for the microactuator and/or the load device.

Method of fabricating electrically isolated metal MEMS beams and microactuator incorporating the MEMS beam

An improved microactuator magnetic circuit having a simplified assembly, reduced field leakage, and improved passivation methods is disclosed. To simplify assembly, a single magnet is polarized in two magnetic regions so that the single magnet is functionally similar to two separate magnets. In addition, the magnetic circuit can be produced without a top keeper. Field leakage is reduced by expanding the bottom keeper. Finally, corrosion-resistant alloys with acceptable magnetic properties are used in forming the keeper.

Microactuator magnetic circuit

A moving-coil magnetic microactuator is formed by using a dual silicon wafer structure and thin film technologies such as deep trench reactive ion etching, reactive ion etching, plasma-enhanced chemical vapor deposition and metallo-organinc chemical vapor deposition. Several bottom structures are formed from a bottom wafer, each bottom structure having a coil and wires embedded in the surface of the bottom structure. Several top structures are formed from a top wafer, each top structure having a magnet and mechanical stand-offs. The top structures are bonded to the bottom structures so that the magnet is above the embedded coil, separated by an air gap created by the mechanical stand-offs.

Structure and fabrication process for integrated moving-coil magnetic micro-actuator

A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.

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Plymouth, MN, United States of America

Lee Walter