Texas Instruments Corporation

Lee Han Meng@ Eugene Lee

Anis Fauzi Bin Abdul Aziz

Wei Fen Sueann Lim

Sueann Lim Wei Fen

Sarel Bin Ismail

Khoo Yien Sien

You Chye How

Yien Sien Khoo

Anis Fauzi Abdul Aziz

Shu Hui Ooi

A leadframe for electronic systems comprising a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

Flippable leadframe for packaged electronic system having vertically stacked chip and components

A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.

Making a flat no-lead package with exposed electroplated side lead surfaces

A leadframe () for electronic systems comprising a first sub-leadframe () connected by links () to a second sub-leadframe (), the first and second sub-leadframe connected by tiebars () to a frame (); and each link having a neck () suitable for bending the link, the necks arrayed in a line () operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

Flippable leadframe for packaged electronic system having vertically stacked chips and components

A method for forming a multilevel leadframe for an integrated circuit is provided. A conductive sheet is etched from one side to form a thinner region within a frame region for leads lines and bond pads. The conductive sheet is etched to form a plurality of bond pads in a first level of the thinner region arranged in at least a first row and a second row. Each bond pad has a pad width and is separated from an adjacent bond pad by a bond pad clearance distance. The conductive sheet is etched from an opposite side to form a plurality of lead lines in a second level of the thinner region having a line width and is separated from an adjacent lead line by at least a lead line clearance distance. Each bond pad of the second plurality of bond pads is connected to one of the plurality of lead lines on the second level that is routed between adjacent bond pads in the first row, so that the lead lines are routed on a different level from the bond pads.

Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides

A semiconductor system () has a flat interposer () with a first surface () in a first plane, a second surface () in a parallel second plane, and a uniform first height () between the surfaces; the interposer is patterned in metallic zones separated by gaps (), the zones include metal of the first height and metal of a second height () smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first () and a second () set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe () is attached to the second terminals of the second set chips, and a second leadframe () is attached to respective metallic zones of the second interposer surface.

Stacked semiconductor system having interposer of half-etched and molded sheet metal

A semiconductor device has a leadframe with a first () and a parallel second surface, and an assembly pad () bordered by two opposing sides, which include a plurality of through-holes () from the first to the second pad surface. Another pad side includes one or more elongated windows () between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads () with opposite elongated sides castellated by indents (). Layers () of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip () is attached to the pad and wire-bonded () to the bond spots. A package () encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.

Packaged semiconductor device having leadframe features preventing delamination

A method of making an integrated circuit ('IC') device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.

Integrated circuit package fabrication

An integrated circuit (IC) die including a top surface and a bottom surface, a plurality of spaced apart ground connection traces positioned between the top surface and the bottom surface; with a hole in the die exposing the plurality of spaced apart ground connection traces.

Integrated circuit assembly

A method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.

Integrated circuit package

A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.

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Johor, Malaysia

Lee Han Meng@ Eugene Lee