Honeywell International Inc.

Lee H Tullidge

Leonard De Oto

Herb Gertz

Tim Larson

Patrick O'Keefe

William M Tillinghast

A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Hole in pad thermal management

A method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Method for providing an efficient thermal transfer through a printed circuit board

An electronics packaging assembly () includes: an assembly housing (); a plurality of printed circuit boards () arranged in parallel within the assembly housing (); and a vibration stiffener (). The printed circuit boards () each have a notch () on one edge. The vibration stiffener () is arranged within the assembly housing () along a lateral direction relative to the plurality of printed circuit boards () and includes a plurality of slots () that engage with corresponding notches () of the plurality of printed circuit boards (), wherein engagement of the vibration stiffener () with the plurality of printed circuit boards () limits flexing of the printed circuit boards () in the lateral direction. In one implementation, a portion of the assembly housing () contacts and applies pressure to the vibration stiffener () to keep the vibration stiffener () in place.

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Urbana, OH, United States of America

Lee H Tullidge