Hughes Electronics Corporation

Lee E Coleman

Michael J Grall

Ronald M Campbell

A simple joining process for members of passive microwave structures is described which reduces passive intermodulation. The process forms an aperture in a first member and forms a second member to have dimension which exceeds the aperture dimension by a dimension differential. The members are joined by initially causing them to have a temperature differential that is sufficient to permit the second member to be positioned across the aperture. The dimension differential is selected to generate mutually-induced radial stresses in the members, after the temperature differential is removed, which enhance the metal-to-metal contact between the members and, thereby, improve passive intermodulation (PIM) performance. Preferably, the dimension differential is selected to cause the second member to elastically buckle and exert a buckling stress against the first member. Additional interface structures are provided to resist operational axial forces, e.g., vibration, that tend to dislodge the members.

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Fullerton, CA, United States of America

Lee E Coleman