Taiwan Semiconductor Manufacturing Comp. Ltd.

Lee-Der Chen

Jiaw-Ren Shih

Jian-Hong Lin

Ming-Hong Hsieh

Bi-Ling Lin

Chwei-Ching Chiu

Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.

Growing community of inventors

Chupei, Taiwan

Lee-Der Chen