Texas Instruments Corporation

Lee A Lewis

Michael Louis Hayden

Jeffrey Wilson

Kurodearimasu Takeshi Hirose

James Dove

Clessie A Troxtell, Jr

Charles M Hess

Laura A Hnilo

Daniel R Wikander

A containment device for retaining semiconductor wafers having a first housing member having a frame with inner and outer walls normal to the frame having a gapped relation. The inner wall receives the semiconductor wafers. A second housing member securably attachable to the first housing member by plural latches has a frame forming the top of the device. Each latch has a hook secured to the first housing member passing through a hole in the second housing member and releasably secured within the hole by the hook. In a second embodiment, the latches and holes are replaced with a plurality of rotatable latch members each having a hook at the distal end for engagement with a hole in the second housing member, secured to the first housing member and rotatable about a hinge. One wall of the first embodiment is replaced with a soft liner which absorbs shock.

Containment device for retaining semiconductor wafers

A containment device for retaining semiconductor wafers ( ) which includes a first housing member ( ) having a frame ( ), an inner wall ( ) and an outer wall ( ), the inner wall ( ) and outer wall ( ) having a spaced apart relationship forming a gap ( ) therebetween. The inner wall ( ) closely receives the semiconductor wafers ( ). The containment device also includes a second housing member ( ) that is securably attachable to the first housing member ( ) and which has a frame ( ) that forms the top of the containment device when the first and second housing members ( ) are securably attached together. The first and second housing members are secured by a plurality of latches ( ), each with a hook ( ) secured to the first housing member which passes through a hole ( ) in the second housing member and is releasably secured within the hole by the hook. In accordance with a second embodiment of the invention, the latches and holes of the first embodiment are replaced with a plurality of rotatable latch members ( ) which are secured to the first housing member and are rotatable about a hinge ( ), each latch member ( ) having a hook ( ) at the distal end thereof for engagement with a hole ( ) in the second housing member. One of the walls ( ) of the first embodiment is removed and replaced with a liner of a very soft rubber or foam ( ), preferably of an antistatic variety, which will absorb shock applied to the housing.

A containment device for retaining semiconductor wafers (,) is disclosed. The containment device comprises a first housing member (,) having a frame (,), an inner wall (,) and an outer wall (,). The inner wall (,) and outer wall (,) each extend generally perpendicularly from the frame (,). The inner wall (,) and outer wall (,) have a spaced apart relationship forming a gap (,) therebetween. The inner wall (,) closely receives the semiconductor wafers (,). The containment device also comprises a second housing member (,) that is securably attachable to the first housing member (,). The second housing member (,) has a frame (,) that forms the top of the containment device when the first and second housing members (,) are securably attached together.

A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house 'tote'. Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.

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Murphy, TX, United States of America

Lee A Lewis