Rockwell Automation Technologies Incorporated

Dci Marketing, Inc.

Adaptive Micro Systems, Inc.

Lee A Gettelfinger

Dennis L Kehl

Steven C Kaishian

Lawrence D Radosevich

Bruce C Beihoff

Mark G Phillips

Timothy A Roebke

Lixiang Wei

Navid RezA Zargari

Rangarajan M Tallam

Richard Lukaszewski

Bruce W Weiss

Garron Koch Morris

Daniel G Kannenberg

Neil Gollhardt

Andreas A Meyer

Kevin Louis Baumann

Stephen E Denning

William E Brumsickle

Robert Wright Reese

Gary M Richter

Michael William Loth

Kelly James Bronk

Robert Allen Savatski

Gregory P Schleusner

Kevin Baumann

Motor drive power conversion systems are provided including a rectifier and a switching inverter, wherein the switching devices of the rectifier, the inverter and/or of a DC/DC converter are silicon carbide switches, such as silicon carbide MOSFETs. Driver circuits are provided for providing bipolar gate drive signals to the silicon carbide MOSFETs, including providing negative gate-source voltage for controlling the off state of enhancement mode low side drivers and positive gate-source voltage for controlling the off state of enhancement mode high side drivers.

Motor drive with silicon carbide MOSFET switches

An apparatus and method for mounting additional components, such as capacitors, to a DC bus of a motor drive. In one aspect, a motor drive includes an enclosure defining an interior, an input for receiving input electrical power from a power source, an output for providing output electrical power to a load, an intermediate DC circuit including a DC bus located in the interior of the enclosure, and a modular capacitor bus electrically coupled with the intermediate DC circuit, the modular capacitor bus including at least one capacitor mounted thereto. The modular capacitor bus is mountable as a unit to the DC bus.

Split laminated DC bus structure

Decorative badge

A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.

Power electronic switching device with laminated bus

An adaptable mounting system for mounting an LED display panel on an existing support structure for a billboard is provided, where the support structure including a plurality of posts having brackets arranged to support the billboard. The adaptable mounting system includes a lower arm and upper arms, each arm having a first end and a second end and one or more notches supported on the brackets of the existing support structure; a yoke coupled to the arms proximate the first end and configured for attachment to the LED display panel; and a brace coupled to one of the upper arms proximate the second end and coupled to the yoke of an arm beneath the one of the upper arms.

Adjustable LED sign mounting system

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter connection configuration

Bus structure for power switching circuits

EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved EMI shielding

Power converter having improved EMI shielding

A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.

Power backplane for power electronic devices

Growing community of inventors

Brown Deer, WI, United States of America

Lee A Gettelfinger