Medtronic, Inc.

Medtronic Minimed, Inc.

Lea A Nygren

Rajesh V Iyer

Mukul Jain

Christine Gale Kronich

Michael G Marinkov

Stephanie L McCracken

Andrew J Ries

Timothy G Laske

Thomas Edward Meyer

Steven T Deininger

Joseph F Lessar

Brad Conrad Tischendorf

Jeffrey J Clayton

Gonzalo Martinez

Mark E Henschel

Markus W Reiterer

Lynn M Seifried

Shawn D Knowles

James Strom

William D Wolf

Scott J Brabec

James A Coles, Jr

Songhua Shi

Jemmy Sutanto

Kelly Lu

Randy G Rose

Wayne R Kuechenmeister

Steven M Dufon

Willam D Wolf

Joyce K Yamamoto

Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.

Feedthrough header assembly and device including same

Systems and methods for forming probes for a biosensor. In the systems and methods disclosed herein, a base substrate is provided; and a platinum layer is formed on the base substrate by sputtering platinum in the absence of oxygen. The platinum layer is formed using a sputtering pressure of at least 30 mtorr.

Sputtering techniques for biosensors

Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.

Implantable medical device and feedthrough and method of making same

An implantable medical electrode includes a substrate and an iridium oxide surface, which is formed by an iridium oxide film applied over a roughened surface of the substrate. The film is preferably applied via direct current magnetron sputtering in a sputtering atmosphere comprising argon and oxygen. A sputtering target power may be between approximately 80 watts and approximately 300 watts, and a total sputtering pressure may be between approximately 9 millitorr and approximately 20 millitorr. The iridium oxide film may have a thickness greater than or equal to approximately 15,000 angstroms and have a microstructure exhibiting a columnar growth pattern.

Medical electrode including an iridium oxide surface and methods of fabrication

An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.

Electronic module assembly for filtered feedthroughs

A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

Compact connector assembly for implantable medical device

An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA comprises a non-conductive block having a top side, a bottom side, a front side and a back side. A plurality of conductive strips are coupled to the non-conductive block. Each conductive strip possesses a front side and a back side. The back side of each conductive strip extends from the front side across the top side and over to back side of the non-conductive block.

An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

Implantable electrodes having zirconium nitride coatings

A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

Method for fabrication of low-polarization implantable stimulation electrode

A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

Means for increasing implantable medical device electrode surface area

A feed-through assembly for an IMD and a method for fabricating the same are provided. The feed-through assembly has a ferrule having a first aperture disposed therethrough. An insulating member is disposed at least partially within the first aperture. The insulating member has a second aperture, an inside surface and an outside surface. A metallization region overlies at least a portion of the inside surface and at least a portion of the outside surface of the insulating member. The metallization region is formed of a first layer of titanium and a second layer of niobium. A portion of a terminal pin of platinum is disposed through the second aperture. A first brazing seal is disposed between the insulating member and the ferrule and a second brazing seal is disposed between the insulating member and the terminal pin. The first and second brazing seals are formed of gold.

Growing community of inventors

Bloomington, MN, United States of America

Lea A Nygren