Delta Electronics (shanghai) Co., Ltd

Delta Electronics, Inc.

Le Liang

Xiaoni Xin

Shouyu Hong

Yan Chen

Zhenqing Zhao

Jianhong Zeng

Kai Lu

Pengkai Ji

Chaofeng Cai

Zhen-Qing Zhao

Yiqing Ye

Shou-Yu Hong

Qingdong Chen

Tao Wang

Min Zhou

Zeng Li

Jinping Zhou

A power module and a manufacturing method thereof are disclosed. The power module includes a first board, a magnetic component, a second board and a power device. The first board includes a conductive component disposed between a first side and a second side opposite to each other. The magnetic component is disposed between the first side and the second side and includes a magnetic core and a winding. A first conductive terminal and a second conductive terminal are led out on the first side and the second side, respectively. The second board is disposed on the first board and includes a third side and a fourth side opposite to each other. The fourth side faces the first side. The power device is disposed on the third side of the second board and electrically connected to the first board.

Power module and manufacturing method thereof

A power chip includes: a first power switch, formed in a wafer region and having a first and a second metal electrodes; a second power switch, formed in the wafer region and having a third and a fourth metal electrodes, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged; and a metal region, at least including a first metal layer and a second metal layer that are stacked, each metal layer including a first to a third electrodes, and electrodes with the same voltage potential in the metal layers are electrically coupled.

Power chip

A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

Method for manufacturing a stack structure

A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.

Manufacturing method of power module

The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.

Power supply module and manufacture method for same

A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.

Power integrated module

The present disclosure provides an alternatingly-switched parallel circuit, an integrated power module and an integrated power package. The alternatingly-switched parallel circuit includes a first bridge arm and a second bridge arm at least partly formed in a chip containing a plurality of first cell groups and a plurality of second cell groups. The plurality of first cell groups are configured to form the first upper bridge-arm switch and the plurality of second cell groups are configured to form the second upper bridge-arm switch, or the plurality of first cell groups are configured to form the first lower bridge-arm switch and the plurality of second cell groups are configured to form the second lower bridge-arm switch. The plurality of first cell groups and the plurality of second cell groups are switched on and off alternatingly.

Alternatingly-switched parallel circuit, integrated power module and integrated power package

A power chip includes: a first power switch, formed in a wafer region and having a first and a second metal electrodes; a second power switch, formed in the wafer region and having a third and a fourth metal electrodes, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged along a first direction; and a metal region, at least including a first metal layer, a second metal layer and a third metal layer that are stacked, each metal layer including a first to a third strip electrodes, and strip electrodes with the same voltage potential in two adjacent metal layers are electrically coupled, wherein a routing direction of the strip electrode in the first metal layer is substantially perpendicular to the first direction.

A power chip and a bridge circuit are disclosed in the present disclosure. The power chip includes a metal region and a wafer region, wherein the power chip further includes: a first power switch, formed in the wafer region; and a second power switch, formed in the wafer region, wherein the first and second power switches constitute an upper bridge arm and a lower bridge arm of a bridge circuit, respectively. At least one of the upper bridge arm and the lower bridge arm includes two or more power switches which are connected in parallel with each other, and the first and second power switches are arranged alternatively along at least one dimension direction.

Power chip and bridge circuit

The present disclosure provides an alternatingly-switched parallel circuit, an integrated power module and an integrated power package. The alternatingly-switched parallel circuit includes a first bridge arm and a second bridge arm at least partly formed in a chip containing a plurality of first cell groups and a plurality of second cell groups The plurality of first cell groups are configured to form the first upper bridge-arm switch and the plurality of second cell groups are configured to form the second upper bridge-arm switch, or the plurality of first cell groups are configured to form the first lower bridge-arm switch and the plurality of second cell groups are configured to form the second lower bridge-arm switch. The plurality of first cell groups and the plurality of second cell groups are switched on and off alternatingly.

A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

Power modules and pin thereof

Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.

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Shanghai, China

Le Liang