Cisco Technology, Inc.

Le Gao

Yang Sun

Yepeng Chen

Bruce Chen

Na Feng

Rudong Shi

Qiang Li

Daniel Bernard Hruska

Yun Bai

Ye Peng Chen

An apparatus that includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

Heatsink with visual installation indicator

A disk array includes a drive enclosure and a pair of rails. The drive enclosure includes a tray with a first base leg and a second base leg spaced from the first base leg, where the tray facilitates receipt of a memory drive device at a space between the first and second base legs such that the drive locking pins engage with openings along surfaces of the memory drive device. A handle pivotally connects with the tray to facilitate rotational movement of the handle in relation to the tray. A pair of rails secure to a printed circuit board (PCB) of an electronic device, and the rails receive and retain portions of the tray and the handle when the tray is inserted between the rails of the pair.

High density and tool-less drive enclosure for a disk array

In one embodiment, an apparatus includes a module for use in installing a heatsink, the module comprising a fastener, a first indicator member comprising a first visual indicator surface, and a second indicator member comprising a second visual indicator surface, the first and second indicator members defining an opening for receiving the fastener. The first visual indicator surface is visible when the fastener is not fully installed and the second visual indicator surface is visible when the fastener is fully installed. A method for installing the heatsink with the module is also disclosed herein.

A solid state drive (SSD) device includes a cage with a top wall and a bottom wall spaced a distance from the top wall so as to define a cage interior between the top and bottom walls. In addition, at least 10% of an area along a side of the cage is open to the cage interior to permit airflow through the side of the cage. At least one printed circuit board (PCB), which includes at least one integrated circuit component, is also provided within the cage interior.

Thermal management cage for a solid state drive

A scalable multiprocessor computing system includes first and second computing devices and a link module connecting the computing devices. The link module includes a guide connector that aligns and couples the first computing device with the second computing device in an orientation in which a printed circuit board assembly (PCBA) support housing wall of the first computing device faces a PCBA support housing wall of the second computing device, a bracket member that is connected along corresponding lengthwise sides of the first and second computing devices, and a cable connector that provides a signal connection between the processor of the first computing device and the processor of the second computing device. The guide connector is connected to the bracket member.

Link module for a scalable multiprocessor system

The embodiments herein describe a computing device (e.g., a storage server) that includes at least one telescoping unit which includes a plurality of removable (or pluggable) hardware components. The computing device includes a chassis which defines a form factor of the computing device. The telescoping unit, when prompted by the user, can extend vertically from a top surface of the computing device. By doing so, the pluggable hardware components are then exposed to the user who can add or replace the components. In one embodiment, the telescoping unit includes telescoping links disposed on opposite sides which are used to guide or urge the telescoping unit vertically from the chassis. Cross links may be coupled between first and second rails where one end of each of the links is coupled to a sliding member in the rail while the other end is fixably attached to the rail.

Telescoping unit in a computing device

In one embodiment a disk array enclosure includes: a two rack (2RU) enclosure configured with a multiplicity of rows of backplane slots on an inner bottom panel of the 2RU enclosure, a multiplicity of 2.5 inch disks mounted lengthwise in parallel to the inner bottom panel, and a multiplicity of paddle cards, each connected to one of the 2.5 inch disks and slotted into one of the backplane slots.

Growing community of inventors

Shanghai, China

Le Gao