International Business Machines Corporation

Globalfoundries Inc.

Layne A Berge

Matthew Stephen Doyle

John Richard Dangler

Thomas W Liang

Manuel Orozco

Jason J Bjorgaard

Kyle Schoneck

Matthew A Walther

George Russell Zettles, Iv

Benjamin A Fox

Wesley David Martin

Trevor Joseph Timpane

Joseph Paul Kuczynski

Patryk Gumann

Paul Eric Dahlen

Patrick Kevin Egan

Sean Hart

David W Siljenberg

Michael Scott Good

Daniel Ramirez

Curtis Eugene Larsen

Jesse Hefner

Timothy Lindquist

Pat Rosno

George Zettles

Evan G Colgan

Timothy Joseph Chainer

Mark Delorman Schultz

Phillip V Mann

Karl Robert Erickson

Matthew Stephen Kelly

Kent Harold Haselhorst

Monty Montague Denneau

George Francis Paulik

Jeffrey N Judd

Kai R Schleupen

Timothy Clyde Buchholtz

Timothy Joseph Schmerbeck

Ray Clement Laning

Brandon R Christenson

Justin E Henspeter

Jarrett Betke

Henry Michael Newshutz

Thomas A Haselhorst

Sierra Spring

Kevin Daniel Escobar

Diego Anzola

One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.

Field-adjustable flex circuit transmission line filters

A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.

Intelligent advanced engine braking system

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Ground discontinuities for thermal isolation

Method, apparatus and computer program product for spur detection in a sampled waveform in a mixed analog/digital system using the magnitude of the frequency response comprising acquiring a sample waveform including a set of discrete uniformly spaced samples from a target system, wherein the sample waveform is a time domain vector; applying FFT transforming the time domain vector into the frequency domain; analyzing the frequency domain response including calculating the magnitude response; and determining whether the sample waveform has spurs including comparing the magnitude response to an average noise floor threshold including determining that the magnitude response having an average noise floor value above the average noise floor threshold has one or more spurs and determining that the magnitude response having an average noise floor value below the average noise floor threshold has no spurs, wherein a spur indicates unaligned data having a delayed bit flip.

Spur detection in a sampled waveform in a mixed analog/digital system using the magnitude of the frequency response

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Ball grid array current meter with a current sense wire

Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Optimizing mounting points for coaxial RF connectors

A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.

Sonar scanning water cooled coaxial cables

An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.

Cryogenic chamber connector

One or more systems, devices, and/or methods provided herein relate to a process for in-process radio frequency (RF) signal quality analysis and amplitude adjustment of one or more RF devices. In one or more embodiments, the RF device can comprise a portion of a quantum computing system, such as of readout electronics thereof, and thus amplitude adjustment can be at a waveform generator that generates pulses to affect one or more qubits of a quantum logic circuit of the quantum computing system. Generally, an electronic device can comprise an RF tap connected to an RF signal component of a first RF signal chain, and an analysis component connected to the RF tap, the analysis component configured to convert an RF signal from the RF signal component and to compare a conversion result thereof to an expected power output that is based on historical data for a second RF signal chain.

Radio frequency signal integrity verification

A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

Vacuum-assisted BGA joint formation

A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.

Feature selection through solder-ball population

A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.

Temperature-dependent capacitor

One or more sampling parameters of an application associated with a downstream voltage regulator may be determined. A power supply rejection ratio ('PSRR') and a switching frequency of an upstream voltage regulator may be dynamically adjusted based on the sampling parameters of the application associated with the downstream voltage regulator. The sampling parameters may include a noise level and a workload of the selected application.

Dynamic adjustment of power supply ripple ratio and frequency in voltage regulators

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

Co-axial grid array capacitor assembly

Growing community of inventors

Rochester, MN, United States of America

Layne A Berge