Cypress Semiconductor Corporation

Spansion Llc.

Lay Hong Lee

Gin Ghee Tan

Cheng Sim Kee

Lai Beng Teoh

Mohamed Suhaizal Bin Abu-Hassan

Yin Lye Foong

A method for manufacturing a semiconductor device is disclosed. In one embodiment a semiconductor die is formed overlying a substrate. The semiconductor die is flip chip mounted to the substrate, wherein the substrate comprises a plurality of conductive traces. The semiconductor die and substrate are encapsulated with an encapsulating material. A top side of the encapsulating material is subjected to one of polishing, etching, and grinding to expose a top side of the semiconductor die. Finally, the bottom side of the substrate is subjected to one of polishing, etching, and grinding to remove the substrate and to reduce a thickness of the plurality of conductive traces.

High performance low profile QFN/LGA

A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips.

Multi-chip module having a support structure and method of manufacture

Growing community of inventors

Penang, Malaysia

Lay Hong Lee