Henkel IP Holding Gmbh

Henkel US IP Lcc

Other

Henkel Ag & Company, Kgaa

Laxmisha Sridhar

Anthony Francis Jacobine

Smita M Shah

John Gregory Woods

Andrew D Messana

Timothy M Champagne

Philip T Klemarczyk

Jiangbo Ouyang

Sean M Burdzy

Benny E Jordan

XianMan Zhang

Jonathan B Israel

Osama M Musa

Charles Willard Paul

Paul B Foreman

Yuxia Liu

Eric N Silverberg

Donald Herr

Swapnali Chaudhari

Austin Sloan

Andrew Slark

Bruce Stevens

Smita Shah

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Cationically curable compositions with latent reducing agent demonstrating low cure temperature

Copolymers prepared by a reaction of (1) an unactivated olefin, (2) an activated olefin, and (3) a hydroxyl functional activated olefin and/or a hydroxyl functional unactivated olefin are described. The copolymers have a backbone of polar vinyl monomers and non-polar alkene monomers, with pendant hydroxyl functional groups. The copolymers are well suited for optically clear, pressure sensitive, polyurethane and/or barrier adhesives.

Olefin-acrylate copolymers with pendant hydroxyl functionality and use thereof

Disclosed is a simplified process for formation of polyisobutylene functionalized with at least one terminal primary or secondary alcohol. The process comprises subjecting an olefin functional polyisobutylene, butyl rubber, or mixtures thereof to ozonation and reduction thereby forming mono-alcohol and diol functional polyisobutylene. The formed functional polyisobutylenes can serve as precursors for many other functionalized polyisobutylenes including urethane polyisobutylenes, urethane polyisobutylenes capped with (meth)acrylate functions, and (meth)acrylate capped polyisobutylenes.

Synthesis of functionalized polyisobutylenes

Disclosed are photoinitiators that are ultra violet (UV) reactive. The photoinitiators can be polymerized into polymeric backbones for use in UV curable hot melt pressure sensitive adhesives. The preferred polymeric backbones are acrylic-based polymers. The photoinitiators are very UVC sensitive and have excellent hot melt viscosity stability that is many fold higher than existing photoinitiators. The subject photoinitiators feature aryl ketones linked through an ether linkage to a variety of connector sequences that allow for polymerization of the photoinitiators.

Photoinitiators that are polymeric or polymerizable for use in UV curable pressure sensitive adhesives

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;) and the like (collectively, &#x201c;subcomponents&#x201d;), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

Diene/dienophile couples and thermosetting resin compositions having reworkability

Disclosed are reactive functionalized, PIB grafted polymers having an architecture of one or more pendent polyisobutylene moieties grafted on to an organic backbone, wherein the backbone is not polyisobutylene and contains at least one telechelic, reactive functionality. Also a process for making the reactive functionalized, PIB grafted polymer s and curable compositions comprising the reactive functionalized, PIB grafted polymers.

Grafted telechelic polyisobutylenes possessing reactive functionality, processes for preparing the same and curable compositions comprising the same

The present invention discloses polymers prepared from polar vinyl monomers and non-polar olefin monomers with the polymers having high olefin content and high weight average molecular weights as well as methods of preparing them. The inventive polymers possess interesting properties that make them particularly attractive in several industrial applications.

High molecular weight polymers having high olefin content

The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds

Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.

Silicone acrylic hybrid polymer-based adhesives

A cationically polymerizable composition comprising (i) a cationically polymerizable resin, (ii) an onium salt, (iii) an azo or peroxide initiator, exhibits a lower cure temperature upon the addition of (iv) a catalytic or substoichiometric amount of an electron-rich vinyl resin to the reaction. 

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Monmouth Junction, NJ, United States of America

Laxmisha Sridhar