Harris Corporation

Lawrence Wayne Shacklette

Louis Joseph Rendek, Jr

Michael Raymond Weatherspoon

Philip Anthony Marvin

Paul Brian Jaynes

David M Smith

Robert Patrick Maloney

Casey Philip Rodriguez

Joshua P Bruckmeyer

Louis J Rendek

Arthur Wilson

Mark Donald Rahmes

Michael Ray Lange

Marc Waterloo

Gary M Singer

Mervin D Fagan

Glenroy Weimar

Paul Brain Jaynes

Louis Joseph Rendek

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic device may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer electronic device

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with air, and positioning at least one biasing member in the membrane switch recess.

A dental imaging system may include an X-ray source, a first optical alignment device, and a dental image collection device. The dental image collection device may include a mouthpiece, at least one electronic X-ray sensor carried by the mouthpiece, and a second optical alignment device carried by the mouthpiece and cooperating with the first optical alignment device to facilitate optically aligning the mouthpiece with the X-ray source. The system may also include a dental image processing device coupled to the at least one electronic X-ray sensor.

Dental image collection device providing optical alignment features and related system and methods

A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

Method for making electrical structure with air dielectric and related electrical structures

A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with a compressible dielectric material, and positioning at least one biasing member in the membrane switch recess.

Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch

A method for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions.

Method to make a multilayer circuit board with intermetallic compound and related circuit boards

Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.

Digital data device interconnects

Systems () and methods () for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well () in a first substrate () having a first Coefficient of Thermal Expansion ('CTE'); forming at least one three-dimensional micro-coaxial interconnect () on the first substrate so as to have a cantilevered end portion () disposed over the well; and using a first coupler () to electrically couple the cantilevered end portion to a second substrate () having a second CTE different from the first CTE. The cantilevered end portion has an angled joint () so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

Compliant high speed interconnects

Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate () having a first surface () and a second substrate () having a second surface () facing the first surface. The system also includes a plurality of battery cell layers (-) disposed on a plurality of laterally spaced areas on the first and second surfaces (). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells () on the first and the second surfaces that are laterally spaced apart and that define one or more batteries.

Dual layer solid state batteries

A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

Method for making an electrical inductor and related inductor devices

Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate () having a first surface () and a second substrate () having a second surface () facing the first surface. The system also includes a plurality of battery cell layers (-) disposed on a plurality of laterally spaced areas on the first and second surfaces (). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells () on the first and the second surfaces that are laterally spaced apart and that define one or more batteries ().

An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods

A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

Growing community of inventors

Melbourne, FL, United States of America

Lawrence Wayne Shacklette