Hewlett-packard Development Company, L.P.

Lawrence Thurber

Rio Rivas

Garrett E Clark

Ed Friesen

Rosanna L Bigford

Chris Aschoff

Henry Kang

Kelly B Smith

Anthony J Galvan

Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.

Controlling adhesives between substrates and carriers

A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Stacked adhesive lines

Growing community of inventors

Albany, OR, United States of America

Lawrence Thurber