Advanced Interconnect Technologies Limited

Lawrence R Thompson

Frank J Juskey

Daniel K Lau

An semiconductor device package () includes a semiconductor device (die) () and passive devices () electrically connected to a common lead frame (). The lead frame () is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads () and a plurality of interposers (). The passive devices () are electrically connected to the interposers (), and I/O pads () on the die () are electrically connected to the leads (). The die (), passive devices (), and lead frame () are encapsulated in a molding compound (), which forms a package body (). Bottom surfaces () of the leads () are exposed at a bottom face () of the package ().

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San Jose, CA, United States of America

Lawrence R Thompson