Ampex Corporation

Trigon Incorporated

Lawrence R Teeple, Jr

Andrew K Magyary

Kenneth N Severs

An IC carrier package test probe including a test probe head which is formed to penetrate into the IC chip cavity of the carrier package and which includes an elastic base having a thin layer of metal foil affixed to the outer face thereof, which foil is slited for greater elasticity and which is disposed to make simultaneous contact with each interior lead contact point within the cavity to permit rapid electrical testing of the continuity of the carrier package circuitry.

Integrated circuit carrier package test probe

The invention provides a modification of the conventional rolling loop transport system, which enables the system to operate at the relatively high pull-down speeds required to match the 1.3 millisecond vertical blanking times of a video format, thereby allowing use of the improved transport in a video system. The instant transport utilizes two gaps in a rotor set apart at 180.degree., entrance of the film at a selected shallow angle, a shortened distance from the exposure gate to the film outlet with no decay of the film loop until expulsion, and a secondary pair of fixed registration pins disposed at the point of expulsion of the film at the film outlet which, in conjunction with a vacuum platen extending from the exposure gate to the film outlet, significantly reduces the jitter at the exposure gate, to allow the use of the transport in high density laser or electron beam recorders.

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Palo Alto, CA, United States of America

Lawrence R Teeple, Jr