Hewlett-packard Company

Lawrence R Hanlon

Farid Matta

Armand P Neukermans

James H Boyden

Marvin S Keshner

Marcos Karnezos

Donald R Bradbury

Cheng-Cheng Chang

Ravindhar K Kaw

Garrett A Garrettson

Steven G Eaton

Bahram Afshari

Timothy R Groves

An apparatus and method for providing electrical contact between an array of fingers of a tape automated bonding frame and a corresponding array of raised contact areas on a substrate. The tape automated bonding frame is preferably a multi-metal member having at least one utility plane. A load plate having downwardly projecting regions is pressed onto the tape automated bonding frame on a side opposite to the substrate. The substrate may be a printed circuit board and the raised contact areas may be conductive pads. The ends of the fingers of the tape automated bonding frame are precisely aligned with the raised contact areas of the substrate. The downwardly projecting regions of the load plate are generally rigid and provide a compression force between adjacent contact areas and between adjacent finger ends. Displacement of the tape automated bonding frame provided by the downwardly projecting regions of the load plate cause the finger ends to conform to the upper surfaces of the contact areas, thereby insuring effective electrical contact between the finger ends and the contact areas.

Shearing stress interconnection apparatus and method

A system of interconnecting electrical components having conflicting bonding requirements for mounting the components to a printed circuit board. The system includes a primary printed circuit board having a pattern of through-holes and having arrangements of connection sites to receive electrical components. For example, the connection sites of the primary printed circuit board may be of the type to receive components associated with the bonding requirements of surface mounting. A secondary printed circuit board has a pattern of through-holes corresponding to the pattern of through-holes of the primary printed circuit board. The circuit boards are wave soldered or surface mounted together by means of the corresponding patterns of through-holes. Attached to the secondary printed circuit board is one or more electrical component having bonding requirements which conflict with those of the primary printed circuit board. Preferably, a tape automated bonding frame is in pressure contact with the through-holes of the secondary printed circuit board for electrical communication between the board via the through-holes.

Secondary board for mounting of components having differing bonding

An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.

Flex interconnect module

A self-testing and self-repairing memory system is presented as well as a method for using it and a method for making it. This memory system is constructed from memory chips that have passed an abbreviated wafer probe test. After the memory system is assembled, it tests itself to locate defective memory cells. The memory system may decide to correct these defective memory cells or it may decide to correct them using an error correction code engine. This memory system tests itself during field use to locate defective memory cells. Once these defective memory cells are located, the memory system uses the error correction code engine to correct these defective memory cells. When the error correction code engine becomes overburdened with defective memory cells, then the memory system replaces these defective memory cells.

Defect tolerant self-testing self-repairing memory system

A new type of thermal ink jet print head is provided which is driven by an electron beam. The print head is constructed of an electron permeable thin film (electron window) which in one embodiment, has on one of its surfaces a plurality of electron absorbing (heater) pads that are in thermal contact with an ink reservoir. As electrons from a CRT traverse the thin film and are absorbed by a pad, they introduce an extremely large and rapid temperature increase in the pad. As a result, a sufficient amount of thermal energy is absorbed by the ink to cause a vapor explosion within the ink, thereby ejecting ink droplets from a nearby orifice in the ink reservoir. In another embodiment, the electrons traverse the window and are absorbed in the ink rather than in pads, and in another embodiment the electrons are absorbed directly in the window itself.

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Menlo Park, CA, United States of America

Lawrence R Hanlon