Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Lawrence Prestousa Natan

Adrian Arcedera

Roveluz Lledo-Reyes

Sarah Christine-Sanchez Torrefranca

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

Growing community of inventors

Santa Rosa, Philippines

Lawrence Prestousa Natan