Henkel Corporation

Other

Loctite Corporation

Loctite (r&d) Limited

Henkel Loctite Corporation

Lawrence N Crane

Mark M Konarski

J Paul Krug

John Gregory Woods

Andrew D Messana

Afranio Torres-Filho

Brendan J Kneafsey

Christopher Kemper Ober

Michael George Todd

James T Huneke

Erin K Yaeger

Rebecca Tishkoff

Young Cheol Bae

Gordon C Fischer

Jong-Wook Park

Z Andrew Szczepaniak

Shuyan Yu

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;), and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

Reworkable compositions incorporating episulfide resins

A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith

A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140&#xb0; C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Fluxing underfill compositions

A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140&deg; C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Method of bonding die chip with underfill fluxing composition

This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages (&ldquo;CSPs&rdquo;), ball grid arrays (&ldquo;BGAs&rdquo;), land grid arrays (&ldquo;LGAs&rdquo;), and the like, each of which having a semiconductor chip, such as large scale integration (&ldquo;LSI&rdquo;), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Reworkable thermosetting resin compositions

A positioning device for people in hospital beds is disclosed. The device includes a sheet which is placed under the patient. This is connected by rope to an apparatus on the headboard of the bed. Either by the bed's existing motor, or an independent motor, the patient is moved up in bed towards the headboard. This action eliminates the need for two or more people for the job of positioning a person in bed. The chance of an on-the-job injury is also greatly reduced with this positioning aid.

Patient-positioning device

Growing community of inventors

Brookfield, CT, United States of America

Lawrence N Crane