Kla Corporation

Agilent Technologies, Inc.

Glimmerglass Networks, Inc.

Novelx, Inc.

Applied Materials, Inc.

Kla Tencor Corporation

Keysight Technologies, Inc.

Lawrence Muray

James P Spallas

Bryan P Staker

Andres Fernandez

Alan D Brodie

James Spallas

John Gerling

Ho-Seob Kim

Kuljit Virk

Scott W Indermuehle

Charles S Silver

John Fielden

Abdurrahman Sezginer

Hong Xiao

David Trost

Grace Hsiu-Ling Chen

Grace H Chen

Frank Chilese

Tai-Hon Philip Chang

Qiang Q Zhang

Robert Haynes

William Daniel Meisburger

Marcel Trimpl

Kurt Stephen Werder

Nick Petrone

Alon Rosenthal

Ying Wu

Dimitri Klyachko

T H Philip Chang

Nicholas Petrone

Alex Lipkind

Vera Andreeva

An array of localized auto-focus sensors provides direct measurement of the working distance between each microscope column in the array and the substrate being imaged below. The auto-focus sensors measure the working distance between each column and the imaging substrate as it passes over a point on the substrate to be imaged. The working distance measurement from the sensors is input into a control system, which in turn outputs the required working distance adjustment to the microscope column. The control system independently adjusts microscope working distance and/or physical distance of an individual microscope column in a multi-column microscope based on auto-focus sensor input. The individual microscope columns in the multi-column microscope can also be used as the auto-focus sensor itself.

Auto-focus sensor implementation for multi-column microscopes

Methods and systems for detecting defects in images of a specimen are provided. One system includes a computer subsystem configured for training an ensemble of deep learning models by altering one or more parameters of the ensemble until a pseudo-loss function determined based on output of the ensemble is approximately equal to but not greater than 0.5. The computer subsystem is also configured for detecting defects in runtime specimen images by inputting the runtime specimen images into the trained ensemble and generating runtime labels for the runtime specimen images indicating if a defect has been detected in the runtime specimen images based on outputs of the deep learning models in the trained ensemble.

Ensemble of deep learning models for defect review in high volume manufacturing

A segmented detector device with backside illumination. The detector is able to collect and differentiate between secondary electrons and backscatter electrons. The detector includes a through-hole for passage of a primary electron beam. After hitting a sample, the reflected secondary and backscatter electrons are collected via a vertical structure having a P+/P&#x2212;/N+ or an N+/N&#x2212;/P+ composition for full depletion through the thickness of the device. The active area of the device is segmented using field isolation insulators located on the front side of the device.

Segmented multi-channel, backside illuminated, solid state detector with a through-hole for detecting secondary and backscattered electrons

A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.

Defect inspection and review using transmissive current image of charged particle beam system

An electron beam inspection system is disclosed, in accordance with one or more embodiments of the present disclosure. The inspection system may include an electron beam source configured to generate one or more primary electron beams. The inspection system may also include an electron-optical column including a set of electron-optical elements configured to direct the one or more primary electron beams to a sample. The inspection system may further include a detection assembly comprising: a scintillator substrate configured to collect electrons emanating from the sample, the scintillator substrate configured to generate optical radiation in response to the collected electrons; one or more light guides; one or more reflective surfaces configured to receive the optical radiation and direct the optical radiation along the one or more light guides; and one or more detectors configured to receive the optical radiation from the light guide.

Arrayed column detector

Disclosed are apparatus and methods for detecting defects on a semiconductor sample. An optical inspector is first used to inspect a semiconductor sample with an aggressively predefined threshold selected to detect candidate defect and nuisance sites at corresponding locations across the sample. A high-resolution distributed probe inspector includes an array of miniature probes that are moved relative to the sample to scan and obtain a high-resolution image of each site to detect and separate the candidate defect sites from the nuisance sites. A higher-resolution probe is then used to obtain a higher-resolution image of each candidate site to obtain a high-resolution image of each site to separate real defects that adversely impact operation of any devices on the sample from the candidate defects.

Ultra-high sensitivity hybrid inspection with full wafer coverage capability

A scanning electron microscopy (SEM) system includes a plurality of electron beam sources configured to generate a primary electron beam. The SEM system includes an electron-optical column array with a plurality of electron-optical columns. An electron-optical column includes a plurality of electron-optical elements. The plurality of electron-optical elements includes a deflector layer configured to be driven via a common controller shared by at least some of the plurality of electron-optical columns and includes a trim deflector layer configured to be driven by an individual controller. The plurality of electron-optical elements is arranged to form an electron beam channel configured to direct the primary electron beam to a sample secured on a stage, which emits an electron beam in response to the primary electron beam. The electron-optical column includes an electron detector. The electron beam channel is configured to direct the electron beam to the electron detector.

Array-based characterization tool

An apparatus for inspecting a substrate is described. The apparatus includes an X-Y stage that supports a substrate to be inspected and is operable to move a substrate supported thereby in X and Y directions; and an imaging system including a plurality of beam columns operable to irradiate regions of a substrate supported by the X-Y stage with beams of energy, respectively, discrete from one another. Respective ones of the beam columns are movable relative to others of the electron beam columns.

Imaging apparatus having a plurality of movable beam columns, and method of inspecting a plurality of regions of a substrate intended to be substantially identical

A scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) apparatus that includes a scanning electron microscope, an x-ray detector, and an auxiliary acceleration voltage source. The scanning electron microscope includes a sample holder, and a layered electron beam column arranged to output an electron beam towards the sample holder at an initial beam energy. The auxiliary acceleration voltage source is to apply an auxiliary acceleration voltage between the sample holder and the layered electron beam column to accelerate the electron beam to a final beam energy. At the final beam energy, the electron beam is capable of generating x-rays at multiple wavelengths from a larger range of atomic species than the electron beam at the initial beam energy.

High-voltage energy-dispersive spectroscopy using a low-voltage scanning electron microscope

A scanning charge particle apparatus includes a layered charged particle beam column package; a sample holder; and a heater, such as a resistive heater, in one of the layers of the package that conductively heats layers and/or components.

Layered scanning charged particle apparatus package having an embedded heater

A scanning charged particle microscope includes a layered charged particle beam column package; a sample holder; and a layered micro-channel plate detector package located between the column package and the sample holder.

Layered scanning charged particle microscope package for a charged particle and radiation detector

A scanning charged particle apparatus includes a layered charged particle beam column package; a sample holder; and a layered differential pumping aperture that assists in maintaining two different vacuums.

Layered scanning charged particle microscope with differential pumping aperture

A charged particle beam column package includes an assembly (e.g., comprising a plurality of layers, which can have a component coupled to one of the layers), and at least one deflector between an extractor and aperture of the assembly. Further, at least one of the layers has interconnects thereon.

Integrated deflectors for beam alignment and blanking in charged particle columns

A micro-electrical system, such as a lens stack for use in a scanning electron microscope, analysis tool, etc., comprises recesses and/or serrations that increase the surface path breakdown, thereby increasing reliability and enabling high voltage operations.

Stacked lens structure and method of use thereof for preventing electrical breakdown

A beam column array included alignment marks within to enable alignment of beams with respect to each other. Specifically, the array includes an array of beam columns, each column having at least once lens. A plurality of alignment marks are located beneath the lens. A method of using the array includes: scanning a plurality of beams in a beam column array over a plurality of alignment marks; and determining beam centroid positions of the beams with respect to each other based on data from the scanning.

Growing community of inventors

Moraga, CA, United States of America

Lawrence Muray