Applied Materials, Inc.

Micronix Partners

Lawrence M Rosenberg

Jayakumar Gurusamy

John M White

Manoocher Birang

Sasson Roger Somekh

Gee Sun Hoey

Alexander Medvinsky

Steven M Zuniga

Shijian Li

Thomas H Osterheld

James V Tietz

Ramin Emami

Martin Scales

A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.

Chemical mechanical polishing apparatus with rotating belt

Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system

A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.

Method and apparatus for providing and controlling delivery of a web of polishing material

A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.

System for chemical mechanical planarization

A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.

Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet

A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

Chemical mechanical polishing conditioner

A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.

A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

Carrier head with a multilayer retaining ring for chemical mechanical polishing

Alignment apparatus particularly for a semiconductor wafer (140) includes a horizontal support plate (134), a horizontal rotatable theta plate (106) below the support plate and a horizontal x-y motion plate below the rotatable plate. Three piezoelectric linear drive motors (128-130) are mounted depending from the rotatable plate and having linear shafts (128a, etc.) extending thereabove to support the support plate, drive the support in the z-axis and then differentially operated to tilt the support plate. A pair of linear piezoelectric motors (110,115) drive the motion plate in x- and y-directions. A theta drive linear piezoelectric motor (137) functions to rotate the theta plate (106). Flexure connections (113, 117, 119, 121, 138, 144) are provided between the various motors and plates. Mask registration means (124, 125) extends upwardly past the edges of the plates to initially gap the wafer-to-mask distance. The mask (150) is held in a separate aligner (153) above the wafer (14) mounted on the support plate. The assembly of six piezoelectric motors and flexural linkages provides for movement of a wafer in six degrees of freedom.

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San Jose, CA, United States of America

Lawrence M Rosenberg