Gte Products Corporation

Other

Lawrence L Hope

Ernest A Davey

Henry T Hidler

Timothy Fohl

William J Roche

Roger B Hunt, Jr

Martin P Schrank

John L Plumb

Charles E Deschenes

Mohamed I Abdalla

Robert Shimer

A fluorescent lamp comprises at least one layer of a quad-phosphor blend for emitting visible illumination having a white color. The quad-phosphor blend comprising a first and second green emitting phosphor component with each green emitting phosphor component having different visible emission spectrum principally in the 520 to 560 nm wavelength range. A third blue emitting phosphor component has an emission spectrum principally in the 440 to 470 nm wavelength range. A fourth red emitting phosphor component has an emission spectrum principally in the 590 to 620 nm wavelength range. The first green emitting phosphor component is a alkaline earth metal activated phosphor and the second green emitting phosphor is a rare earth activated phosphor wherein the relative proportions of the phosphor components are such that an enhanced color rendering index is produced as compared to tri-component blends formed from three of the phosphor components.

Fluorescent lamp with improved phosphor blend

The present invention is directed to novel AC thin film electroluminescent display devices employing a protective dielectric stripe along the edges of the transparent electrode (or conductor). In particular, the present invention is directed to an AC thin film electroluminescent display device comprising:

Edge breakdown protection in ACEL thin film display

An improved hermetic seal means for use in an electroluminescent display device for joining the protective cover sheet (glass) over the base substrate. The base substrate has typically deposited thereon multiple thin film layers. The hermetic seal comprises an electrically insulative thin film layer disposed over the conductive thin film leads associated with the multiple thin film layers, and metallic solder means over the insulative thin film layer to provide a bond between the cover sheet and base substrate.

Electroluminescent display device

A process for bonding one or more target parts, such as yttrium oxide target parts, to a copper backing plate to provide improved mechanical support and improved heat transfer. The process is one in which a noble metal, preferably platinum, is applied to the target to provide an oxide free layer to which indium/lead solder joins. The solder step is performed so that contamination by flux or by formation of an oxide is prevented.

Target bonding process

In an electroluminescent display device, an integral thin film resistor means including a plurality of discrete thin film resistors formed by thin film deposition and having a resistor in series and associated with each driven segment. In the preferred device the thin film resistors are deposited in a predetermined pattern on the back glass in conjunction with back glass electrode deposition whereby electrical connection is made to the electroluminescent device at the back glass.

Thin film electroluminescent display

A sputtering cathode apparatus for the deposition of thin films which are produced at a relatively high deposition rate. A relatively large planar magnetron sputtering system or apparatus is provided with a preferred single convoluted electron path so as to obtain high geometric efficiency. The target is larger than the substrate and the substrate motion is confined to an area within the defined target area. The cathode system requires a vacuum system of relatively small dimension due to the increase in target size in comparison with substrate size along with the provision for multiple plasma legs separated by non-emissive regions therebetween. This construction enables minimized substrate motion relative to the target.

Sputtering cathode apparatus

The deposition of thin films is carried out by a co-sputtering cathode technique particularly suited for deposition of doped thin films on large area substrates. A relatively large planar magnetron sputtering apparatus having a rectangular (picture frame shaped) plasma region is provided to obtain efficient sputtering of the host material. A vacant center area defined by the plasma region is provided for diode sputtering of the dopant. In RF sputtering, co-excitation of the power source is desired to prevent RF mode beating.

Thin film deposition by sputtering

A process and associated system for forming a thin film phosphor layer which is comprised of a host substance doped with an activator and which layer is formed by a sputtering process. Heat is applied to the substrate to elevate the temperature thereof while maintaining a vacuum in the sputtering chamber. The substrate is supported for movement in the chamber. Sputtering is accomplished within the chamber by causing a sputtering gas to flow therein while concurrently exciting host and activator targets to form a plasma in the chamber and maintaining this sputtering for a predetermined period of time.

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Stow, MA, United States of America

Lawrence L Hope