Growing community of inventors

Los Angeles, CA, United States of America

Lawrence Kulinsky

Average Co-Inventor Count = 1.53

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 16

Lawrence KulinskyBenjamin Dolan (2 patents)Lawrence KulinskyTuo Zhou (2 patents)Lawrence KulinskyEdward Tackett (2 patents)Lawrence KulinskyArash Kheradvar (1 patent)Lawrence KulinskyMarc Madou (1 patent)Lawrence KulinskyLing Kong (1 patent)Lawrence KulinskyVictor H Perez-Gonzalez (1 patent)Lawrence KulinskyVinh Ho (1 patent)Lawrence KulinskyLawrence Kulinsky (13 patents)Benjamin DolanBenjamin Dolan (2 patents)Tuo ZhouTuo Zhou (2 patents)Edward TackettEdward Tackett (2 patents)Arash KheradvarArash Kheradvar (45 patents)Marc MadouMarc Madou (12 patents)Ling KongLing Kong (1 patent)Victor H Perez-GonzalezVictor H Perez-Gonzalez (1 patent)Vinh HoVinh Ho (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. University of California (10 from 15,462 patents)

2. International Rectifier Corporation (3 from 1,231 patents)


13 patents:

1. 11912900 - Step-wise fabrication of conductive carbon nanotube bridges via dielectrophoresis

2. 11840769 - Guided template based electrokinetic microassembly (TEA)

3. 11534832 - Selective laser sintering using functional inclusions dispersed in the matrix material being created

4. 11142738 - Sieve system and methods for cell media exchange

5. 11001002 - Powder bed additive manufacturing method of fabricating a porous matrix

6. 10799952 - Selective laser sintering using functional inclusions dispersed in the matrix material being created

7. 10245614 - Imprinter for conformal coating of three-dimensional surfaces

8. 10166541 - Centrifugal microfluidic platform for automated media exchange

9. 9353455 - Dielectrophoresis and electrodeposition process for selective particle entrapment

10. 8641883 - Polymer-based high surface area multi-layered three-dimensional structures and method of making same

11. 7525178 - Semiconductor device with capacitively coupled field plate

12. 6768211 - Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging

13. 6621166 - Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging

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12/13/2025
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