Arch Specialty Chemicals, Inc.

Ocg Microelectronic Materials, Inc.

Fujifilm Electronic Materials U.s.a., Inc.

Arch Chemicals, Inc.

Olin Hunt Specialty Products Inc.

Olin Microelectronic Chemicals, Inc.

Lawrence Ferreira

Andrew J Blakeney

Sanjay Malik

Medhat A Toukhy

Arturo N Medina

Joseph J Sizensky

Brian E Maxwell

Sobhy Tadros

Ahmad A Naiini

Alfred T Jeffries, Iii

Kenji Honda

Ognian N Dimov

Vincent G Leon

Michelle Elderkin

Gregory Domenic Spaziano

John P Hatfield

J Thomas Kocab

John A McFarland, Jr

James G Favier, Jr

Edward A Fitzgerald

Whewell Allyn

Jeffrey Eisele

A non-corrosive cleaning composition that is aqueous-based, non-hazardous and will not harm the environment and is useful primarily for removing both fresh and aged plasma etch residues from a substrate. The composition comprises (a) water; and (b) a synergistic combination of at least one tricarboxylic acid and at least one carboxylic acid. Preferably, the at least one carboxylic acid has a pKa value ranging from 3 to 6. Also, a method for removing etch residues from a substrate. The method includes the steps of (a) providing a substrate with etch residue; and (b) contacting the substrate with a cleaning composition comprising water; and a synergistic combination of at least one tricarboxylic acid and at least one carboxylic acid.

Non-corrosive cleaning compositions for removing etch residues

A photoacid compound having the following general structure:R&#x2014;O(CF)SOXwherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C-Clinear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF)O)(CF)&#x2014; wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals.

Photoacid generators for use in photoresist compositions

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

t-butyl cinnamate polymers and their use in photoresist compositions

The present invention is directed to a process of removing trace acidic impurities from an impure solution of photoacid generating compounds in a solvent, comprising contacting an impure solution of at least one photoacid generating compound containing trace amounts of acidic impurities with an amine-containing ion exchange resin for a sufficient amount of time to remove substantially all of the acidic impurities from the impure solution, thereby producing a pure solution of at least one photoacid generating compounds substantially free of trace acidic impurities. The invention is also directed to a solution of at least one photoacid generating compound substantially free of trace acidic impurities made by the above process.

Method of purifying photoacid generators for use in photoresist compositions

Production of acetal derivatized hydroxyl aromatic polymers and their

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.

Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the variables are as defined in the description.

Selected O-quinonediazide sulfonic acid esters of phenolic compounds and

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.

O-quinonediazide sulfonic acid esters of phenolic compounds and their

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formulae (IB) and (IIB): ##STR1## wherein the photosensitive compound is used in a positive photoresist composition and process for forming patterned image. Further the invention is drawn to a positive photoresist composition comprising an alkali-soluble resin and quinone diazide sulfonic acid triesters and diesters characterized by their HPLC peak areas.

Selected o-quinonediazide sulfonic acid esters of phenolic compounds and

A method of removing metal impurities from a resist component, comprising the steps of:

Method for removing metal impurities from resist components

A radiation-sensitive composition comprising an admixture in a solvent of: at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one polylactide compound; the amount of said binder resin being about 60 to 95% by weight, the amount of said photoactive component being about 5% to about 40% by weight, based on the total solids content of said radiation-sensitive composition.

Polylactide compounds as sensitivity enhancers for radiation sensitive

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Fall River, MA, United States of America

Lawrence Ferreira