Honeywell International Inc.

Honeywell G.m.b.h.

Lawrence E Frazee

Joel D Stolfus

Wayne A Lamb

Peter A Schelonka

John S Patin

Lamar Floyd Ricks

Eugene D Alfors

Kenneth L Eichholz

Paul E Smith

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Chip on lead frame for small package speed sensor

A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Magnet orientation and calibration for small package turbocharger speed sensor

A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.

Vane actuated magnetic drive mode sensor

A geartooth sensor is provided with a carrier shaped to form a cavity in which semiconductor chips can be disposed. The carrier partially encapsulates a permanent magnet and a lead assembly. Unencapsulated portions of the lead assembly are exposed within the cavity to permit semiconductor components to be attached to a portion of the lead assembly. A cover is attached to the carrier to seal the cavity and protect the magnetically sensitive components located therein. The carrier, with its associated lead assembly and permanent magnet, can then be attached to a printed circuit board and a support structure to form a geartooth sensor. A protective enclosure can be disposed over the sensitive components of the geartooth sensor.

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Freeport, IL, United States of America

Lawrence E Frazee