Raytheon Company

Lawrence Dalconzo

Tamrat Akale

Robert Chris Allison

James M Harris

Christopher A Moye

David J Drapeau

Eduardo D Barrientos, Jr

Michael T Crnkovich

Herbert K Jew

Eduardo D Barrientos

Jr Barrientos Eduardo D

A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths. The second mechanism further includes a first input waveguide that extends from the input switching network vertically through at least one groundplane layer and to an input end of the first circuit component. The third mechanism includes a first output waveguide extending from an output end of the first circuit component, vertically through at least one groundplane layer to an output switching network disposed on the switching layer. In the specific embodiment, the circuit layer includes plural circuit components that are coupled to respective input waveguides and output waveguides that extend vertically through the first groundplane layer to the input switching network and the output switching network, respectively.

Compact multilayer circuit

A multi-channel microwave switched filter bank, wherein the input circuitry and output circuitry are mounted on opposite sides of the filter bank, providing a compact structure with excellent isolation. The filter bank includes a set of microwave band pass filter circuits. A housing structure provides an outer conductive peripheral frame structure. A rack structure disposed within the housing structure has a plurality of elongated slots for mounting therein corresponding ones of the plurality of filter circuits. A top dielectric substrate board is mounted adjacent a first side of the rack structure and has a first set of openings formed therein for providing access to a first set of input/output (I/O) ports of the plurality of filter circuits. A bottom dielectric substrate board is mounted adjacent a second side of the rack structure opposite the first side and has a second set of openings formed therein for providing access to a second set of input/output (I/O) ports of the plurality of filter circuits.

Low profile, high isolation and rejection x-band switched filter assembly

A compact thick film substrate for filtering, shielding, and routing multiple lines of dc and control signals between isolated ports of a microwave integrated circuit. The substrate circuit includes a dielectric substrate having upper and lower substrate surfaces and first and second side surfaces. A first ground plane layer is formed on the upper substrate surface. A first thick film assembly is formed on the first ground plane layer, and includes a first thin dielectric layer, a first set of thin conductive traces formed on the thin dielectric layer and onto the first and second side surfaces terminating in a first set of edge trace pads formed on the first side surface and a second set of edge trace pads formed on the second side surface, a second thin dielectric layer formed over the upper substrate surface covering the first set of traces such that the traces are sandwiched and shielded between adjacent first surfaces of the first and second dielectric layers, and a second ground plane formed on a second surface of the second dielectric layer. The first and second sets of trace pads are exposed for connection to adjacent circuitry. A second thick film assembly is formed on the lower surface of the substrate to provide third and fourth sets of trace pads for connection to the adjacent circuitry.

Compact z-axis DC and control signals routing substrate

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Los Angeles, CA, United States of America

Lawrence Dalconzo