International Business Machines Corporation

Celanese Gmbh

Chemfab Corporation

Pisces-print Imaging Sciences, Inc.

Lawrence D David

Anthony Mastreani

Srinivasa S Reddy

Shaji Farooq

Rao Venkateswara Vallabhaneni

Renuka S Divakaruni

Donald Rene Wall

Mark A Takacs

Govindarajan Natarajan

Charles Hampton Perry

Lester W Herron

Timothy Charles Krywanczyk

John Acocella

Vivek M Sura

Richard M Arons

Farid Youssif Aoude

Hal Mitchell Lasky

John Ulrich Knickerbocker

Jon Alfred Casey

Eric Jeffrey White

Sarah Huffsmith Knickerbocker

James N Humenik

Harbans S Sachdev

Robert W Nufer

Ajay Prabhakar Giri

John A Effenberger

Paul M Feeney

Richard B Booth

Matthew T Tiersch

Steven M Kandetzke

Lisa A Fanti

George Czornyj

Timothy P Pollock

Herbert R Anderson, Jr

Richard A Bates

Mark O Neisser

Arnold I Baise

Peter A Agostino

David R Clarke

Daniel P Kirby

Lovell B Wiggins

Salvatore J Scilla

Liang-Choo Hsia

Christopher M Comeaux

Katherine M Sahlin

Amy T Matts

Werner E Dunkel

Allen J Dam

Ray M Bryant

John W Verbicky

Richard L Stone

Laura A Socha

Kenneth Parker Rodbell

Krishna Gandhi Sachdev

Robert William Pasco

William L Guthrie

Srinivasa S N Reddy

Frank Benjamin Kaufman

Umar M Ahmad

Anton Nenadic

Albert S Deutsch

William J Patrick

Jeffrey William Carr

Derek B Harris

Hsing Hsiung Chen

David B West

Hsing H Chen

A process for imaging a lithographic printing plate having a presensitizing coating. An ink jet printer is used to apply imagewise micro drops of an insolubilizing solution that insolubilizes exposed areas of the coating. The latent image is then developed. The process works with conventional, commercially available developing processors.

Chemical imaging of a lithographic printing plate

A blended solid composition is provided containing a fibrillatable microparticulate PTFE polymer in an unfibrillated state and at least one elastomeric and/or fluoroplastic component. The composition is useful in making microfiber-reinforced solid compositions and articles produced therefrom.

Fluoropolymeric composition

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate, liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.

Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers

A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.

Chemical mechanical polishing slurry and method for polishing metal/oxide layers

A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes 375 ml of a 9% wt alumina suspension, about 200 grams ferric nonahydrate, water to dilute to about 4.5 liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.0 to 1.5.

Chemical mechanical polishing slurry for tungsten

A method is provided for etching and removing extraneous molybdenum or debris on ceramic substrates such as semiconductor devices and also for molybdenum etching in the fabrication of molybdenum photomasks. The method employs a multi-step process using an acidic aqueous solution of a ferric salt to remove (etch) the molybdenum debris followed by contacting the treated substrate with an organic quaternary ammonium hydroxide to remove any molybdenum black oxides which may have formed on the exposed surface of treated molybdenum features in ceramic substrates. The method is environmentally safe and the waste solutions may be easily waste treated for example by precipitating the ferric salts as ferric hydroxide and removing anions such as sulfate by precipitation with lime. The method replaces the currently used method of employing ferricyanide salts which create serious hazardous waste disposal and environmental problems.

Method of etching molybdenum metal from substrates

A process and etchant solution for chemical wet etching of thin film metals in the presence of a protected metal. The etching solution has a pH range of about 2.7 to 4.0. The etching solution may include hydrogen peroxide, potassium sulfate, and potassium EDTA, and it reduces or eliminates the incidence of etch-resistant metal without damaging the protected metal.

Process improvements for titanium-tungsten etching in the presence of

Copper-based paste containing copper aluminate for microstructural and

A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

Copper-based paste containing refractory metal additions for

A molybdenum etching process which reduces hazardous treatment waste is disclosed. Etchants which can be used are ferric sulfate and ferric ammonium sulfate. Waste products resulting from this etch are Fe(OH).sub.3 and CaSO.sub.4.

Etching molydbenum with ferric sulfate and ferric ammonium sulfate

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Wappingers Falls, NY, United States of America

Lawrence D David