Corning Incorporated

Thorlabs Quantum Electronics, Inc.

Corning Incorporarted

Lawrence Charles Hughes

Chung-En Zah

Catherine Genevieve Caneau

Feng Xie

Satish Chandra Chaparala

Jacques Gollier

Stephan Lvovich Logunov

James Scott Sutherland

Garrett Andrew Piech

William James Miller

Venkata Adiseshaiah Bhagavatula

Alexander Mikhailovich Streltsov

Joseph Francis Schroeder, Iii

Kamjula Pattabhirami Reddy

Martin Hai Hu

Richard Robert Grzybowski

John Himmelreich

Robert Addison Boudreau

Brewster Roe Hemenway, Jr

Joseph F Schroeder

Etienne Almoric

Karen Irene Matthews

Songsheng Tan

Brewster R Hemenway

Chris P Brophy

Mark F Krol

Deepukumar M Nair

Aniruddha S Weling

A method of characterizing a monolithic tunable mid-infrared laser including a heterogeneous quantum cascade active region together with a least first and a second tunable integrated distributed feedback gratings, the method including operating the laser while tuning the first grating through its full tuning range, while holding the reflectivity function of the second grating constant, then operating the laser while tuning the second grating through its full tuning range, while holding the reflectivity function of the first grating constant.

Monolithic wide wavelength tunable mid-IR laser sources

A monolithic tunable mid-infrared laser has a wavelength range within the range of 3-14 &#x3bc;m and comprises a heterogeneous quantum cascade active region together with at least a first integrated grating. The heterogeneous quantum cascade active region comprises at least one stack, the stack comprising two, desirably at least three differing stages. Methods of operating and calibrating the laser are also disclosed.

Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.

Fracture resistant metallization pattern for semiconductor lasers

Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.

Edge bonded optical packages

An optical package includes a semiconductor laser, a wavelength conversion device and a MEMS-actuated mirror oriented on a base module to form a folded optical pathway between an output of the semiconductor laser and an input of the wavelength conversion device. An optical assembly is located in a mechanical positioning device and the mechanical positioning device is disposed on the base module along the optical pathway such that the beam of the semiconductor laser passes through the optical assembly, is reflected by the MEMS-actuated mirror back through the optical assembly and into the waveguide portion of the wavelength conversion device. The MEMS-actuated mirror is operable to scan the beam of the semiconductor laser over the input of the wavelength conversion device. The optical assembly may be adjusted along the optical pathway with the mechanical positioning device to focus the beam into the waveguide portion of the wavelength conversion device.

Optical packages and methods for aligning optical packages

Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps () formed in a glass substrate (or). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

Glass-based micropositioning systems and methods

The present invention relates to lensed fiber stub assemblies and optical and optoelectronic packages including them. The fiber stub assemblies include a section of lensed fiber having a lensed end having a lens face, and a distal end having an endface, a lens alignment ferrule affixed to and holding the lensed end of the lensed fiber, and a package attachment ferrule having a distal endface and an exterior surface, the package attachment ferrule affixed to and holding the distal end of the lensed fiber. The lensed fiber stub assemblies of the present invention allow for hermetic packaging of optical and optoelectronic devices, good manufacturing throughput, facile package connectorization, acceptable device thermal performance, and ease of alignment in the packaging process.

Lensed fiber stub assemblies optical and optoelectronic packages including them

An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Multiple fiber chip clamp

Growing community of inventors

Corning, NY, United States of America

Lawrence Charles Hughes