Lucent Technologies Inc.

American Telephone & Telegraph Co., At&t Bell Laboratories

At&t Bell Laboratories

Bethlehem Steel Corporation

Lawrence Arnold Greenberg

Yinon Degani

Tsvi Goldenberg

Kenneth P Moll

Mark B Cholewa

David J Lando

Lee H Fisher

An integrated circuit package including a die housing an integrated circuit and having a plurality of electrical contact pads on a surface of the die. The electrical contact pads include energizing contact pads for connecting power and ground lines to the integrated circuit, and include data contact pads. The energizing contact pads lie along the path of intersecting first and second directional lines. The intersecting directional lines define four quadrants on the surface of the die, each quadrant containing at least one data contact pad.

Power and ground and signal layout for higher density integrated circuit

A technique for enabling sufficient flow of flux cleaning fluids and an underfill material in the relatively low-profile gap between a flip-chip bonded IC chip and a substrate, such as a printed circuit board, is to provide at least one aperture in the substrate under the IC chip. The use of such an aperture enables, for example, flux cleaning fluid to flow through the aperture into the low-profile gap between the IC chip and the substrate surface, such as by the application of pressure or by gravity, which then exits through openings between formed interconnect bonds at a sufficient flow rate to adequately remove flux residues. An epoxy underfill to the IC chip can be formed in a similar manner. For example, a relatively thick bead of epoxy, such as on the order of the thickness of the IC chip, is deposited or stencil printed on the substrate surface around the edges of the IC chip and capillary action is then relied upon to draw the epoxy into the low-profile gap. Undesirable air pockets which otherwise would develop form the displaced air as the epoxy flows into the low-profile gap can advantageously escape through the aperture of the invention.

Integrated circuit bonding method and apparatus

A method is disclosed for processing an optical fiber to include an integral lens and a metallized outer coating. The fiber is first etched to include a tapered transition region and a thinned end region. The etched fiber is subsequently metallized and covered with a protective coating. A wet chemical etching technique is used to form an integral lens over the endface of the fiber. The protective coating is then stripped and any free metal is removed. The method allows for the fiber metallization to be in relative close proximity to the lens such that the fiber may be soldered into place near its endface, limiting any subsequent movement of the fiber relative to the aligned optical device.

Finishing techniques for lensed optical fibers

Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

Semiconductor package with high density I/O lead connection

Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.

Method of bonding conductors to semiconductor devices

A hot top for the casting of ingots, especially large size rectangular steel ingots having a thickness of at least 28 inches and a width greater than the thickness but no greater than 36 inches. The hot top has an octagonal refractory lined cavity with the lengths of the four corner sides being substantially equal to each other and greater in length than any of the other four sides, but not greater than 1.2 times the length of the longest of the other four sides.

Growing community of inventors

Allentown, PA, United States of America

Lawrence Arnold Greenberg