Adeia Semiconductor Bonding Technologies Inc.

Laurie Union

Gary W Grube

Igor Y Khandros

Thomas H DiStefano

Gaetan L Mathieu

David A Gibson

Jason Sweis

A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.

Connection components with frangible leads and bus

A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap connecting one end of the lead connection section to a bus extending alongside the gap. The frangible section is broken when the lead is engaged with the contact.

Method of making connections to a semiconductor chip assembly

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Santa Clara, CA, United States of America

Laurie Union