International Business Machines Corporation

Globalfoundries Inc.

Laurie M Krywanczyk

Anthony K Stamper

Peter E Biolsi

Gregory S Jankowski

Edward Crandal Cooney, Iii

Structures that include an identification marking and fabrication methods for such structures. A chip is formed within a usable area of a wafer, and a marking region is formed on the wafer. The marking region is comprised of a conductor used to form a last metal layer of an interconnect structure for the chip. The identification marking is formed in the conductor of the marking region. After the identification marking is formed, a dielectric layer is deposited on the marking region. The dielectric layer on the marking region is planarized.

Laser scribe structures for a wafer

A method of forming a damascene structure, and the structure so formed, using a sacrificial conductive layer to provide a uniform focus plane for the photolithography tool during formation of circuit features. In particular, a metal layer is provided between the insulative layer and the photoresist, upon which the capacitive sensors of the photolithography tool focus during the formation of the circuit features, namely, troughs and vias.

Damascene structure using a sacrificial conductive layer

A method of forming a damascene structure using a sacrificial conductive layer to provide a uniform focus plane for the photolithography tool during formation of circuit features. In particular, a metal layer is provided between the insulative layer and the photoresist, upon which the capacitive sensors of the photolithography tool focus during the formation of the circuit features, namely, troughs and vias.

Growing community of inventors

Essex Junction, VT, United States of America

Laurie M Krywanczyk