Lear Corporation

Acondicionamiento Tarrasense

UniversitÄt Autonoma De Barcelona

Laurent Aubouy

Xavier Jorda-Sanuy

Magí Galindo Anguera

Oscar Alonso Almirall

Mirko Faccini

David Amantia

Diego Morillo Martín

Miquel Vellvehi-Hernandez

Xavier Perpina-Giribet

Jose Gabriel Fernandez-Banares

Jordi Suarez-Jimenez

Jose Alberto Saez-Zamora

Christophe Aucher

Esther Delgado Rodríguez

David GUTIÉRREZ-Tauste

ÁNgel M Valdivielso Pablo

Diego Morillo MARTÍN

Gustavo PÉREZ GONZÁLEZ

Guadalupe Borja RODRÍGUEZ

Janina Serra Comellas

Rosa Escudero Moreno

Miguel Osset HERNÁNDEZ

The present invention refers to a method for polishing polyamide objects obtained by additive manufacturing or 3D printing techniques, which comprises immersion of the polyamide object in a mixture of formic acid and dichloromethane at room temperature for a period of time comprised between 5 seconds and 6 minutes. This method allows effectively elimination or reduction of the roughness of the polyamide objects obtained by additive manufacturing or 3D printing techniques, for example, obtained by techniques such as the Selective Laser Sintering (SLS) with a simple procedure which does not require neither high temperatures nor extended treatment times. The present invention also refers to the object obtainable according to such method.

Method for polishing polyamide objects obtained by additive manufacturing or 3D printing techniques

In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.

Electrically-cooled power module

Growing community of inventors

Terrassa, Spain

Laurent Aubouy