Smartrac Investment B.v.

Other

Infineon Technologies Ag

Qimonda Ag

Smartrac Technology Gmbh

Laurence Singleton

Ray Freeman

Henry Prescher

Patrick Mende

Alex Boellaard

Carsten Nieland

Frank Kriebel

Jesus Mennen Belonio

Alexander Wollanke

Juergen Simon

A motor casing and a combination of a motor casing and a plug connection, the motor casing being designed for a drive of movable components of a vehicle, in particular sunroofs, blinds or roofs of convertible. A plug is inserted in the motor casing and a gap is provided between the motor casing and the plug connection. According to the disclosure, at least one projection is provided in the area of the gap and avoids play between the motor casing and the plug connection.

Threshold sensor with RFID communication ability

A differential pressure sensor with wireless RFID communication ability senses and records a specified differential pressure threshold without great energy consumption and without requiring direct access or visual inspection of the sensing element. The differential pressure sensor includes a sensing element sensing a differential pressure between a low pressure side and a high pressure side and a RFID tag comprising a tag antenna, a tag integrated circuit (IC) and a tamper loop connected to the tag IC for tracking a specific differential pressure threshold of the differential pressure sensor. The RFID tag is connected to the sensing element in such a way that the tamper loop is triggered if the specific differential pressure threshold has been reached.

Differential pressure sensor with RFID tag

This invention relates generally to ID frequency identification (RFID) transponders and receivers. More specifically to the methods, apparatus and systems of the fabrication of the transponders and receivers. In one example embodiment, to methods, apparatus, and systems to form effective barriers for devices having a layer structure, including encapsulating at least a portion of the side of the devices from being degraded due to impurity penetration into a laminate structure of the devices, which can cause corrosion or malfunction of the devices.

Barrier configurations and processes in layer structures

The invention relates to a method for producing chips () by dividing a wafer along dividing lines () defining dimensions of the chip, wherein a focus () of a preferably pulsed laser radiation () is moved along the dividing lines on a first and at least a second path () within the wafer body, wherein the laser radiation is applied to the wafer from a rear side () of the wafer, and the power density for producing the defects () on the first path () is lower than the power density for producing the defects () on the second path (), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Method of separating chips from a wafer

A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the conductive structures are exposed to the exterior.

Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

A stack of semiconductor chips includes a substrate or an interposer board comprising conductor structures for electrical connection of the stack and a first chip. The first chip includes an active side with peripherally arranged bonding pads and is mounted face-up on the substrate or the interposer board. The stack beyond includes at least a further chip with peripherally arranged bonding pads on its active side. The back side and at least two chip edges of the further chip are embedded by a mold cap providing a protuberance on the back side of the chip. The protuberance forms a planar surface extending substantially parallel and with a distance to the back side of the chip. The further chip is attached face-up to the active side of the first chip by an adhesive applied between the protuberance and the first chip so that the protuberance is inserted between both chips to provide a gap there. The protuberance has at least one linear dimension that is smaller than a linear dimension of the subjacent chip.

Growing community of inventors

Dresden, Germany

Laurence Singleton