Adeia Semiconductor Bonding Technologies Inc.

Laura Willis Mirkarimi

Belgacem Haba

Ilyas Mohammed

Rajesh Katkar

Javier A DeLaCruz

Shaowu Huang

Gabriel Z Guevara

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

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Sunol, CA, United States of America

Laura Willis Mirkarimi