Hewlett Packard Enterprise Development LP

Laura Malcotti-sanchez

John P Franz

Steven J Dean

Ernesto Ferrer

A heat removal apparatus may comprise a vapor chamber device and a cover coupled to the vapor chamber device. The vapor chamber device comprises a base, a folded fin structure coupled to the base, with the base and folded fin structure defining a vapor chamber containing a wick and a working fluid. The cover and the vapor chamber device define a liquid chamber configured to receive liquid coolant. The folded fin structure comprises a plurality of folded fins defining a first plurality of grooves on a first side of the folded fin structure and defining a second plurality of grooves on a second side of the folded fin structure. The first plurality of grooves are part of the vapor chamber. The second plurality of grooves are part of the liquid chamber.

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Houston, TX, United States of America

Laura Malcotti-sanchez