Redbud Labs, Inc.

The University of North Carolina at Chapel Hill

Laura Lee Tormey

Richard Chasen Spero

Jay Kenneth Fisher

Modular active surface devices for micro fluidic systems and methods of making same is disclosed. In one example, the modular active surface device includes an active surface layer mounted atop an active surface substrate, a mask mounted atop the active surface layer wherein the mask defines the area, height, and volume of the reaction chamber, and a substrate mounted atop the mask wherein the substrate provides the facing surface to the active surface layer. In other examples, both facing surfaces of the reaction chamber include active surface layers. Further, the modular active surface device can include other layers, such as, but not limited to, adhesive layers, stiffening layers for facilitating handling, and peel-off sealing layers. Further, a large-scale manufacturing method is provided of mass-producing the modular active surface devices. Further, a method is provided of using a plasma bonding process to bond the active surface layer to the active surface substrate.

Modular active surface devices for microfluidic systems and methods of making same

Modular active surface devices for microfluidic systems and methods of making same is disclosed. In one example, the modular active surface device includes an active surface layer mounted atop an active surface substrate, a mask mounted atop the active surface layer wherein the mask defines the area, height, and volume of the reaction chamber, and a substrate mounted atop the mask wherein the substrate provides the facing surface to the active surface layer. In other examples, both facing surfaces of the reaction chamber include active surface layers. Further, the modular active surface device can include other layers, such as, but not limited to, adhesive layers, stiffening layers for facilitating handling, and peel-off sealing layers. Further, a large-scale manufacturing method is provided of mass-producing the modular active surface devices. Further, a method is provided of using a plasma bonding process to bond the active surface layer to the active surface substrate.

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Research Triangle Park, NC, United States of America

Laura Lee Tormey