Fujifilm Planar Solutions, LLC

Motorola Corporation

Laura John

Deepak Mahulikar

James McDonough

James F Vanell

James A Grootegoed

The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Reduction in large particle counts in polishing slurries

A wafer carrier ( ) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier ( ) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring ( ). An elastically flexed wafer support structure ( ) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure ( ) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure ( ) when a down force is applied to the wafer carrier ( ) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.

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Chandler, AZ, United States of America

Laura John