Analog Devices,inc.

Laura Cornelia Popa

Jeffrey A Gregory

Jinbo Kuang

Tyler Adam Dunn

Igor P Prikhodko

Eugene Oh Hwang

Kemiao Jia

Charles Blackmer

Erdinc Tatar

Michael W Judy

Xin Zhang

George M Molnar

Andrew Proudman

Nikolay Pokrovskiy

Christopher Needham

A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.

3-axis gyroscope with rotational vibration rejection

Couplers for selectively coupling in-plane and out-of-plane motion between moving masses are provided herein. In particular, aspects of the present application provide for a coupler configured to couple in-plane motion between moving masses while decoupling out-of-plane motion between the moving masses. The selective couplers as described herein may be used in a device, such as a microelectromechanical systems (MEMS) inertial sensor. In some embodiments, a MEMS inertial sensor comprises a first mass configured to move in-plane, a second mass configured to move in-plane and out-of-plane, and a coupler coupling the first and second masses and comprising two levers coupled to an anchor point by respective tethers and coupled to each other by a spring.

Mechanism for selective coupling in microelectromechanical systems inertial sensors

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Madison, NJ, United States of America

Laura Cornelia Popa