Texas Instruments Corporation

Laura A Hnilo

Roy Alan Hastings

David Alexander Grant

Michael Louis Hayden

Clessie A Troxtell, Jr

Lee A Lewis

Charles M Hess

Mike P Pierce

Daniel R Wikander

A semiconductor chip bearing an alignment mark, particularly useful for wire bonder alignment on chips having bonding surfaces over the active circuits. The marks are fabricated on diagonal corners of the chip, and each mark consists of a pair of touching squares which are rotated about 90 degrees from each other in the opposite chip corners. The unique positioning of the marks, as well as the rotation provides both gross chip position features useful in mounting the chip on a lead frame, as well as fine alignment set-up or teaching aids for wire bonding. The small, high visual contrast features of the alignment mark are fabricated simultaneously with the top active metallization of the IC chip, and are not covered by passivation coating or additional metal layers.

Bonding alignment mark for bonds over active circuits

A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house 'tote'. Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.

Multi-functional shipping system for integrated circuit devices

Growing community of inventors

McKinney, TX, United States of America

Laura A Hnilo