Freescale Semiconductor,inc.

Lau Teck Beng

Chee Seng Foong

Lan Chu Tan

Kong Bee Tiu

Fuaida Harun

Sheng Ping Took

Chiaw Mong Chan

Soo San Yong

A stacked die sensor package includes a die paddle and lead fingers that surround the die paddle. The lead fingers have proximal ends near the die paddle and distal ends spaced from the die paddle. A first semiconductor die is mounted to one side of the die paddle and electrically connected to the lead fingers with first bond wires. A sensor die is mounted to the other side of the die paddle and electrically connected to the lead fingers with sensor bond wires. An encapsulation material covers the first die and the first bond wires, while a gel material and a lid cover the sensor die and the sensor bond wires. The package may also have a second semiconductor die attached on an active surface of the first die and electrically connected one or both of the lead fingers or first die bonding pads with second bond wires.

Stacked die sensor package

An improved method of bonding an insulated wire () that has one end connected to a first bond pad () to a second bond pad () includes moving a tip of a capillary () holding the bond wire () over the surface of the second bond pad () such that the bond wire () is rubbed between the capillary tip () and the second bond pad (), which tears the bond wire insulation so that at least a portion of a metal core of the wire () contacts the second bond pad (). The wire () is then bonded to the second pad () using thermocompression bonding. The tip of the capillary () is roughened to enhance the tearing of the bond wire insulation.

Wirebonding insulated wire and capillary therefor

Growing community of inventors

Petaling Jaya, Malaysia

Lau Teck Beng