Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Laszlo Nobi

S Daniel Cromwell

Jeffrey L Deeney

Joseph D Dutson

A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

Support assembly for an integrated circuit package having solder columns

A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal. Further, by including the processor and a heat sink in the field replaceable apparatus, the field replaceable apparatus reduces handling in the field and the risk of damage to the processor, and may be tested prior to installation in the field to ensure it operates properly.

Method for making a modular integrated apparatus for heat dissipation

Method and apparatus for a modular integrated apparatus for heat

An integrated circuit chip 12 is temporarily associated with a plenum 16 having a fluid chamber 88 in which a heat transfer fluid 46 is circulated in order to heat or cool the chip 12 at a predetermined temperature sufficient to complete a burn-in screening of said chip.

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Fort Collins, CO, United States of America

Laszlo Nobi