Pac Tec - Packaging Technologies Gmbh

Pac Tech Packaging Technologies G.m.b.h.

Lars Titerle

Elke Zakel

Paul Kasulke

Oliver Uebel

Ghassem Azdasht

In a basic variant of a soldering device whereby a laser device is used for melting solder material (), a protective device is provided which protects the laser lens system () from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel () into an outlet channel () and/or by a diaphragm () arranged in front of the laser lens system.

Device for removing solder material from a soldered joint

A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D) is smaller than the diameter (D) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Method and device for applying a solder to a substrate

In order to apply solder material () to a workpiece (), compressed gas is guided through a bore hole () of a capillary (). A pressure sensor () situated in the bore hole () measures the dynamic pressure of the compressed gas. As soon as the tip () of the capillary approaches the workpiece (), the dynamic pressure increases and is used as a measure for the distance between the tip () of the capillary () and the workpiece (), enabling the feed motion of the capillary to be controlled.

Method and device for applying material to a workpiece

The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material () to a work station () in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material () corresponding to the number of capillaries (). An extracting station () is arranged in the transport path from the filling station () to the machining station ('), said extracting station () extracting individual fragments of material () in a selective manner.

Method and device for applying pieces of material to a workpiece

The device for positioning a tool () in relation to a workpiece () controls drives () in relation to three spatial axes (x, y, z) through two cameras (), the first () of which takes an image essentially along a spatial axis (y), the other () being oriented essentially vertically with respect to a surface () of the workpiece.

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Berlin, Germany

Lars Titerle