Robert Boschgmbh

Lars Tebje

Johannes Classen

Arnd Kaelberer

Dietrich Schubert

Patrick Wellner

Jochen Reinmuth

Heiko Stahl

Joerg Braeuer

Frank Fischer

Mirko Hattass

Reinhard Neul

Daniel Christoph Meisel

Rolf Scheben

Axel Franke

Torsten Ohms

Friedjof Heuck

Guenther-Nino-Carlo Ullrich

Amin Jemili

Christian Hoeppner

Rudy Eid

Fouad Bennini

Cristian Nagel

Markus Heitz

Christof Schwenk

Carsten Geckeler

Christian Patak

Christian Bierhoff

Holger Rumpf

Christian Marschall

Chunyu Wang

Guenther Nino-Carlo Ullrich

Jullian Gonska

Johannes Seelhorst

A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

Micromechanical component for a pressure and inertial sensor device

A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.

Micromechanical sensor device and corresponding production method

A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.

Micromechanical system, method for operating a micromechanical system

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Micromechanical structure and micromechanical sensor

A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

Method for operating a micromechanical inertial sensor

A micromechanical inertial sensor, having a substrate; and a seismic mass which is connected to the substrate and developed so that it has a detection capability of a low-g acceleration of approximately 1 g in a first Cartesian coordinate direction, and the seismic mass is furthermore developed so that it has a detection capability of a high-g acceleration of at least approximately 100 g in at least one second Cartesian coordinate direction.

Micromechanical inertial sensor

A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

Method for manufacturing a MEMS element

A micromechanical sensor is provided having a substrate having a main plane of extension and having a movable element, the movable element being pivotable about an axis of rotation that is essentially parallel to the main plane of extension, from a rest position into a deflected position, the movable element having an asymmetrical mass distribution relative to the axis of rotation, so that, as a function of a force exerted on the movable element oriented essentially perpendicular to the main plane of extension, a deflection movement of the movable element is produced in the form of a pivot movement about the axis of rotation, the micromechanical sensor having a damping element, the damping element being pivotable about the axis of rotation,

Micromechanical sensor

A micromechanical acceleration sensor is provided, including

Micromechanical acceleration sensor

For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component.

Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component

A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Micromechanical component and method for manufacturing a micromechanical component

An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.

Inertial sensor with overlapping torsional springs

A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.

Micromechanical structure, in particular sensor arrangement, and corresponding operating method

Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Hybrid intergrated component and method for the manufacture thereof

A micromechanical component comprising a substrate, a seismic mass, and first and second detection means, the substrate having a main extension plane and the first detection means being provided for detection of a substantially translational first deflection of the seismic mass along a first direction substantially parallel to the main extension plane, and the second detection means further being provided for detection of a substantially rotational second deflection of the seismic mass about a first rotation axis parallel to a second direction substantially perpendicular to the main extension plane. The seismic mass can be embodied as an asymmetrical rocker, with the result that accelerations can be sensed as rotations. Detection can be accomplished via capacitive sensors.

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Reutlingen, Germany

Lars Tebje