Danfoss Silicon Power Gmbh

Heidelberger Druckmaschinen Ag

Heraeus Deutschland Gmbh & Co Kg

Lars Paulsen

Frank Osterwald

Ronald Eisele

Jacek Rudzki

Martin Becker

Holger Ulrich

Klaus Kristen Olesen

Holger Beer

Bernd Lassen

Gunnar Behrens

Burkhard Paasch

Andreas Detmers

Sven Mader

Michael Schäfer

Axel Gebhardt

Stefan Schmidt

Christian Meier

Martin Forrer

Axel Trilk

Markus Uihlein

Bernhard Zintzen

Susanne Klaudia Duch

Ole Mühlfeld

Andreas Hinrich

Eckhard Langenbach

Henning Ströbel-Maier

Thomas Rupp

Frank Schefuss

Dirk Ingmar Nitsch

Franke Wulf-Toke

Claus Harbach

Reiner Hinken

Christopher Klaehr

Jens Klinghagen

Anton Miric

Christian Bachmann

Georg Wecker

David Benning

Andre Staack

Klaus Olesen

Sintering tool () with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (), arranged at two locations opposite the cradle, for fixing a protective film () covering the electronic subassembly (BG).

Sintering tool and method for sintering an electronic subassembly

An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

Power module with integrated cooling device

The invention relates to an electronic power system () comprising at least one electronic power module (). The electronic power module () comprises a base plate () and at least one heat generating component arranged on a first side of the base plate (). The electronic power module () comprises a cooling structure () transporting heat away from the electronic power module () via a coolant that is guided by the cooling structure (). The cooling structure () is arranged on a second side () of the base plate () opposite to the first side. Task of the invention is to provide an electronic power system () with an improved cooling. According to the present invention this task is solved in that the cooling structure () is integrally formed with the base plate ().

Electronic power system and method for manufacturing the same

A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. Also specific/different plating could be added to the individual needs of the different pin types without using masks in the plating process.

Lead frame and method of fabricating the same

Tool () for the lower die of a sintering device, the tool () having a rest () for an electronic subassembly () comprising a circuit carrier, to be sintered, where the rest () is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly ().

Sintering tool for the lower die of a sintering device

One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.

Sintering device

The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.

Cooling trough, cooler and power module assembly

The invention relates to a cooling device for a plurality of power modules (), comprising a heat-conducting body () through which a coolant flows. The cooling device comprises external cooling ribs () on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.

Cooling device for a plurality of power modules

A method and an apparatus for controlling the vacuum distribution in an exposer for recording printing originals. The recording material for the printing originals is held firmly on a supporting surface by negative pressure. The recording material being attracted by suction by a vacuum pump via suction grooves machined into the supporting surface and via suction ducts connected to the suction grooves. For opening and closing the suction ducts, valves are provided, the valves being closed by the mechanical action of force from an actuator on a piston rod and opened by the action of compressed air on a piston in the valve. For opening the valve, an outlet opening for the compressed air is integrated into the actuator. In a printing plate exposer with an exposure drum, the suction ducts and the valves are located in the exposure drum, and the actuator is located outside the exposure drum.

Method and apparatus for controlling the vacuum distribution in an exposer for printing originals

A device sets the focus of at least one exposure head on a recording material, in particular a printing plate, in an exposer for recording printing originals. An exposer has an exposure drum for holding the printing plates, and an exposure-head carrier, which contains a carrier plate for holding exposure heads, and a carrier base. The carrier plate and the carrier base are connected such that they can move by a hinge which is disposed on the front side of the exposure-head carrier, facing the exposure drum. The rear of the carrier plate is raised or lowered by a tilting drive, as a result of which the exposure heads are moved jointly and substantially radially toward the exposure drum or away from the exposure drum. The hinge is preferably formed from at least one spring plate.

Device for setting the focus of exposure heads of a printing plate exposer

A compact device for imaging () a printing form (), including a number of light sources () as well as imaging optics () for producing a number of image spots () of the light sources () on the printing form (), the imaging optics () including at least one macro-optical system () of refractive optical components (), the imaging device having the feature that the optical path () from the light sources () to the image spots () passes through the macro-optics () twice. The installation-space saving imaging device () can be used in a printing unit () of a printing press ().

Compact device for imaging a printing form

An apparatus for producing a printing form which, with little expenditure, permits exact beam alignment and positioning. The apparatus for producing the printing form contains a holder for at least one printing form blank, and at least one imaging module, which can be moved relative to the printing form blank and which contains at least one radiation source which, in order to produce image elements that accept printing ink, is aimed at the surface of the printing form blank and whose beam direction can be adjusted. The imaging module being accommodated in a six-point mounting in three bearing locations, each bearing location containing a spherical element and an associated bearing element and in each case the spherical element rests on it and, in order to adjust the beam direction, at least one element of one bearing location being disposed adjustably.

Apparatus for producing a printing form

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Hollingstedt, Germany

Lars Paulsen