Micron Technology Incorporated

Nan Ya Technology Corporation

Lars P Heineck

Shyam Surthi

Jaydip Guha

Sanh D Tang

Haitao Liu

John K Zahurak

Martin Ceredig Roberts

Richard J Hill

Shih-Fan Kuan

Kuo-Chen Wang

Wolfgang Mueller

Yoshiaki Fukuzumi

Scott E Sills

Kamal M Karda

Lifang Xu

Kevin J Torek

Indra V Chary

Si-Woo Lee

Terrence B McDaniel

Yi Fang Lee

Sheng-Wei Yang

Inho Park

David H Wells

Paolo Tessariol

Anish A Khandekar

Adam L Olson

Emilio Camerlenghi

Silvia Borsari

Harsh Narendrakumar Jain

Vinay Nair

Troy R Sorensen

Naveen Kaushik

Jonathan T Doebler

Zhiqiang Xie

A microelectronic device includes a memory array region, a control logic region overlying the memory array region, and a pad region overlying the control logic region. The memory array region includes a stack structure including vertically alternating conductive structures and insulating structures; vertically extending strings of memory cells within the stack structure; at least one source structure vertically underlying the stack structure and coupled to the vertically extending strings of memory cells; and digit line structures vertically overlying the stack structure and coupled to the vertically extending strings of memory cells. The control logic region includes control logic devices configured to effectuate control operations for the vertically extending strings of memory cells. The pad region includes conductive pad structures coupled to the control logic devices. Memory devices and electronic systems are also described.

Microelectronic devices, and related memory devices and electronic systems

An array of vertical transistors comprises spaced pillars of individual vertical transistors that individually comprise an upper source/drain region, a lower source/drain region, and a channel region vertically there-between. The upper source/drain region comprises a conductor oxide material in individual of the pillars. The channel region comprises an oxide semiconductor material in the individual pillars. The lower source/drain region comprises a first conductive oxide material in the individual pillars atop and directly against a second conductive oxide material in the individual pillars. Horizontally-elongated and spaced conductor lines individually interconnect a respective multiple of the vertical transistors in a column direction. The conductor lines individually comprise the second conductive oxide material atop and directly against metal material. The first conductive oxide material, the second conductive oxide material, and the metal material comprise different compositions relative one another. The second conductive oxide material of the conductor lines is below and directly against the second conductive oxide material of the lower source/drain region of the individual pillars of the respective multiple vertical transistors. Horizontally-elongated and spaced conductive gate lines are individually operatively aside the oxide semiconductor material of the channel region of the individual pillars and individually interconnect a respective plurality of the vertical transistors in a row direction. A conductive structure is laterally-between and spaced from immediately-adjacent of the spaced conductor lines in the row direction. The conductive structures individually comprise a top surface that is higher than a top surface of the metal material of the conductor lines. Other embodiments, including method, are disclosed.

Array of vertical transistors and method used in forming an array of vertical transistors

An electronic device comprising multilevel bitlines comprising first bitlines and second bitlines. The first bitlines and the second bitlines are positioned at different levels. Pillar contacts are electrically connected to the first bitlines and to the second bitlines. Level 1 contacts are electrically connected to the first bitlines and level 2 contacts are electrically connected to the second bitlines. A liner is between the first bitlines and the level 2 contacts. Each bitline of the first bitlines is electrically connected to a single pillar contact in a subblock adjacent to the level 1 contacts and each bitline of the second bitlines is electrically connected to a single pillar contact adjacent to the level 2 contacts. Methods of forming an electronic device and related systems are also disclosed.

Electronic devices comprising multilevel bitlines, and related methods and systems

Microelectronic devices include a tiered stack having vertically alternating insulative and conductive structures. A first series of stadiums is defined in the tiered stack within a first block of a dual-block structure. A second series of stadiums is defined in the tiered stack within a second block of the dual-block structure. The first and second series of stadiums are substantially symmetrically structured about a trench at a center of the dual-block structure. The trench extends a width of the first and second series of stadiums. The stadiums of the first and second series of stadiums have opposing staircase structures comprising steps at ends of the conductive structures of the tiered stack. Conductive source/drain contact structures are in the stack and extend substantially vertically from a source/drain region at a floor of the trench. Additional microelectronic devices are also disclosed, as are methods of fabrication and electronic systems.

Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related systems and methods

Some embodiments include an integrated assembly having a pair of adjacent memory-block-regions, and having a separator structure between the adjacent memory-block-regions. The memory-block-regions include a first stack of alternating conductive levels and first insulative levels. The separator structure includes a second stack of alternating second and third insulative levels. The second insulative levels are substantially horizontally aligned with the conductive levels, and the third insulative levels are substantially horizontally aligned with the first insulative levels. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies, and methods of forming integrated assemblies

Methods, apparatuses, and systems related to selectively depositing a liner material on a sidewall of an opening are described. An example method includes forming a liner material on a dielectric material of sidewalls of an opening and a bottom surface of an opening and removing the first liner material of the sidewalls of the opening and the bottom surface of the opening using a non-selective etch chemistry. The example method further includes forming a second liner material on the dielectric material of the sidewalls of the opening to avoid contact with the bottom surface of the opening.

Selective dielectric deposition

A semiconductor memory device includes a semiconductor substrate having active areas and a trench isolation region between the active areas. The active areas extend along a first direction. Buried word lines extend along a second direction in the semiconductor substrate. Two of the buried word lines intersect with each of the active areas, separating each of the active areas into a digit line contact area and two cell contact areas. The second direction is not perpendicular to the first direction. A digit line contact is disposed on the digit line contact area. A storage node contact is disposed on each of the two cell contact areas. The digit line contact and the storage node contact are coplanar. At least one digit line extends along a third direction over a main surface of the semiconductor substrate. The at least one digit line is in direct contact with the digit line contact.

Semiconductor devices

Methods for fabricating a semiconductor memory device

Semiconductor memory device having coplanar digit line contacts and storage node contacts in memory array and method for fabricating the same

An access device includes a plurality of first digit lines (DL) trenches extending along a first direction, buried digit lines between each DL trench, second and third trenches separating the digit lines, a filling material filling the digit line trenches comprising airgaps in each second trench, a plurality of word line (WL) trenches extending along a second direction, metal word lines deposited on the walls of the word line trenches, a filling material filling the word line trenches.

Silicon buried digit line access device and method of forming the same

A circuit structure includes a substrate having an array region and a peripheral region. The substrate in the array and peripheral regions includes insulator material over first semiconductor material, conductive material over the insulator material, and second semiconductor material over the conductive material. The array region includes vertical circuit devices which include the second semiconductor material. The peripheral region includes horizontal circuit devices which include the second semiconductor material. The horizontal circuit devices in the peripheral region individually have a floating body which includes the second semiconductor material. The conductive material in the peripheral region is under and electrically coupled to the second semiconductor material of the floating bodies. Conductive straps in the array region are under the vertical circuit devices. The conductive straps include the conductive material and individually are electrically coupled to a plurality of the vertical circuit devices in the array region. Other implementations are disclosed.

Circuit structures, memory circuitry, and methods

A method of forming an array of recessed access device gate constructions includes using the width of an anisotropically etched sidewall spacer in forming mask openings in an etch mask for forming all recessed access device trenches within semiconductor material within all of the array. The etch mask is used while etching all of the recessed access device trenches into the semiconductor material within all of the array through the mask openings. Individual recessed access gate constructions are formed in the individual recessed access device trenches. Other methods are contemplated, including arrays of recessed access devices independent of method of manufacture.

Arrays of recessed access devices, methods of forming recessed access gate constructions, and methods of forming isolation gate constructions in the fabrication of recessed access devices

A memory cell includes a vertically oriented transistor having an elevationally outer source/drain region, an elevationally inner source/drain region, and a channel region elevationally between the inner and outer source/drain regions. The inner source/drain region has opposing laterally outer sides. One of a pair of data/sense lines is electrically coupled to and against one of the outer sides of the inner source/drain region. The other of the pair of data/sense lines is electrically coupled to and against the other of the outer sides of the inner source/drain region. An access gate line is elevationally outward of the pair of electrically coupled data/sense lines and is operatively adjacent the channel region. A charge storage device is electrically coupled to the outer source/drain region. Other embodiments and additional aspects, including methods, are disclosed.

Memory cells, arrays of memory cells, and methods of forming memory cells

Some embodiments include memory arrays. The memory arrays may have digit lines under vertically-oriented transistors, with the digit lines interconnecting transistors along columns of the array. Each individual transistor may be directly over only a single digit line, with the single digit line being entirely composed of one or more metal-containing materials. The digit lines can be over a deck, and electrically insulative regions can be directly between the digit lines and the deck. Some embodiments include methods of forming memory arrays. A plurality of linear segments of silicon-containing material may be formed to extend upwardly from a base of the silicon-containing material. The base may be etched to form silicon-containing footings under the linear segments, and the footings may be converted into metal silicide. The linear segments may be patterned into a plurality of vertically-oriented transistor pedestals that extend upwardly from the metal silicide footings.

Memory arrays, semiconductor constructions, and methods of forming semiconductor constructions

Growing community of inventors

Boise, ID, United States of America

Lars P Heineck