Endress + Hauser Flowtec Ag

Lars Neyerlin

Stephan Gaberthüel

Hanno Schultheis

Anastasios Badarlis

Alexander Grün

Oliver Popp

Tobias Baur

Martin Barth

Martin Arnold

Rainer Höcker

The present disclosure relates to a process connection for connecting a flow measuring device, to a pipeline, the process connection including a base body having an opening for conducting a medium and a flow rectifier, wherein the flow rectifier is inserted into a first recess of the base body and fixed in place by plastic deformation of an edge region of the base body surrounding the first recess, for example, by press fitting.

Process connection for connecting a flow measuring device to a pipeline, field device for automation technology and method for fastening a flow rectifier to a process connection

The present disclosure relates to a method for producing a probe of a thermal flow meter for measuring the mass flow rate of a medium in a measuring tube, the method having the following steps: introducing a probe core in the form of a material to be melted into a first probe casing, the first probe casing having an open first end and a closed second end facing away from the first end; melting the probe core; quenching the probe core to a temperature below the solidification temperature; attaching a thermoelement to a contact surface of the solidified probe core. The invention also relates to a probe obtained according to the production method and to a flow meter including the probes according to the present disclosure.

Method for producing a sensing element for a thermal flow meter, sensing element and flow meter

The present disclosure relates to a method for manufacturing a probe of a thermal, flow measuring device for measuring mass flow of a liquid in a measuring tube, wherein the method includes: introducing a probe core including a hard solder and a core element into a first probe sleeve, wherein the first probe sleeve has an open first end and a closed second end away from the first end; melting the hard solder; affixing the core element by cooling the hard solder to a temperature less than the solidification temperature; and applying a thermoelement to a contact area of the core element or of the solidified hard solder. The present disclosure relates, furthermore, to a probe resulting from the manufacturing process as well as to a flow measuring device having at least one probe of the-present disclosure.

Thermal flow measuring device including probe having probe core with hard solder

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Wahlen, Switzerland

Lars Neyerlin